Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 14 Issue 4
- /
- Pages.9-14
- /
- 2007
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
Characteristics of Reliability for Flip Chip Package with Non-conductive paste
비전도성 접착제가 사용된 플립칩 패키지의 신뢰성에 관한 연구
- Noh, Bo-In (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Lee, Jong-Bum (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Won, Sung-Ho (Micro Electronic Packaging Consortium, Sungkyunkwan University) ;
- Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
- Published : 2007.12.30
Abstract
In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.
본 연구에서는 가속화 조건에서의 비전도성 접착제가 사용된 플립칩 패키지의 열적 신뢰성에 관하여 평가하였다. 실리콘 칩에