대한기계학회논문집B (Transactions of the Korean Society of Mechanical Engineers B)

  • 제30권10호
  • /
  • Pages.957-965
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  • 2006
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  • 1226-4881(pISSN)
  • /
  • 2288-5324(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
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초정밀 플립칩 접합기용 고성능 가열기의 열적 설계 및 시험

Thermal Design and Experimental Test of a High-Performance Hot Chuck for a Ultra Precision Flip-Chip Bonder

  • 이상현 ((주)탑엔지니어링 기술연구소) ;
  • 박상희 (금오공과대학교 기계공학부) ;
  • 류도현 ((주)탑엔지니어링 기술연구소) ;
  • 한창수 (한국기계연구원 지능형정밀기계부) ;
  • 곽호상 (금오공과대학교 기계공학부)
  • 발행 : 2006.10.01
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초록

A high-performance hot chuck is designed as a heating device for an ultra-precision flip-chip bonder with infrared alignment system. Analysis of design requirements for thermal performance leads to a radiative heating mechanism employing two halogen lamps as heating source. The heating tool is made of silicon carbide characterized by high thermal diffusivity and small thermal expansion coefficient. Experimental tests are performed to assess heat-up performance and temperature uniformity of the heating tool. It is revealed that the initial design of hot chuck results in a good heat-up speed but there exist a couple of troubles associated with control and integrity of the device. As a means to resolve the raised issues, a revised version of heating tool is proposed, which consists of a working plate made of silicon carbide and a supporting structure made of stainless steel. The advantages of this two-body heating tool are discussed and the improved features are verified experimentally.

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참고문헌

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