Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Improvement of Permeation of Solvent-free Multi-layer Encapsulation of Thin Films on Polyethylene Terephthalate (PET)

고분자 기판위에 유기 용매를 사용하지 않은 다층 박막 Encapsulation 기술 개발

  • 한진우 (연세대학교 전기전자공학과) ;
  • 강희진 (연세대학교 전기전자공학과) ;
  • 김종연 (연세대학교 전기전자공학과) ;
  • 서대식 (연세대학교 전기전자공학과)
  • Published : 2006.08.01
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Abstract

The inorganic multi-layer thin film encapsulation was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, sputter, inorganic multi-layer thin-film encapsulation was deposited onto the Polyethylene Terephthalate (PET) and their interface properties between inorganic and organic layer were investigated. In this investigation, the SiON, $SiO_2$ and parylene layer showed the most suitable properties. Under these conditions, the WVTR for PET can be reduced from level of $0.57g/m^2/day$ (bare subtrate) to $1*10^{-5}g/m^2/day$ after application of a SiON and $SiO_2$ layer. These results indicates that the $PET/SiO_2/SiON/Parylene$ barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.

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References

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