대한전기학회논문지:전기물성ㆍ응용부문C (The Transactions of the Korean Institute of Electrical Engineers C)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

$BaTiO_3$ 및 $TiO_2$ 분말이 혼합된 연마제 슬러리(MAS)를 사용한 BTO 박막의 CMP 특성

Chemical Mechanical Polishing Characteristics of BTO Films using $TiO_2$- and $BaTiO_3$-Mixed Abrasive Slurry (MAS)

  • 발행 : 2006.06.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

In this study, the sputtered BTO film was polished by CMP process with the self-developed $BaTiO_3$- and $TiO_2$-mixed abrasives slurries (MAS), respectively. The removal rate of BTO ($BaTiO_3$) thin film using the $BaTiO_3$-mixed abrasive slurry (BTO-MAS) was higher than that using the $TiO_2$-mixed abrasives slurry ($TiO_2$-MAS) in the same concentrations. The maximum removal rate of BTO thin film was 848 nm/min with an addition of $BaTiO_3$ abrasive at the concentration of 3 wt%. The sufficient within-wafer non-uniformity (WIWNU%) below 5% was obtained in each abrsive at all concentrations. The surface morphology of polished BTO thin film was investigated by atomic force microscopy (AFM).

키워드

참고문헌

  1. S. S. Kim and H. Shunichi, 'Structural characterization of epitaxial $BaTiO_3$ thin films grown by sputter deposition on MgO(100)', J. Appl. Phys. 78(9). pp. 5604-5608, 1995 https://doi.org/10.1063/1.360696
  2. Y. J. Sea and W. S. Lee, 'Chemical mechanical polishing of $Ba_{0.6}Sr_{0.4}TiO_3$ film prepared by sol - gel method', Microelectronic Engineering, Vol. 75, Issue 2, p. 149, 2004 https://doi.org/10.1016/j.mee.2004.03.086
  3. P. Vitanov, A. Harizanova, T. Ivannova, D. Velkov, Z. Raytcheva, 'Deposition, structure evolution and dielecrtrc properties of $BaTiO_3$ and $BaxSr_{1-x}TiO_3$ thin films prepared by the sol-gel method.', Vacuum, vol 69, issues 1-3, pp 371-377, December, 2002 https://doi.org/10.1016/S0042-207X(02)00361-5
  4. 이병우, 최경식, 신동우, '수열합성법에 의한 $BaTiO_3$ 분말합성 및 소결체의 제조', Journal of the Korean Ceramic Society, Vol. 40, No. 6, pp. 577-582, 2003 https://doi.org/10.4191/KCERS.2003.40.6.577
  5. G. B. Basim, J. J. Adler, U. Mahajan, R. K. Singh, and B. M. Moudgil, 'Effect of particle size of chemical mechanical polishing with minimal defects', J. Electrochem. Soc., Vol. 147, Iss. 9, p. 3523, 2000 https://doi.org/10.1149/1.1393931
  6. W. Li, D. W. Shin, M. Tomozawa, S. P. Murarka, 'The effect of the polishing pad treatments on the chemical-mechanical polishing of $SiO_2$ films' Thin Solid Films, issues 1-2, vol 270, pp 601-606; December 1995 https://doi.org/10.1016/0040-6090(96)80082-4
  7. W, S. Lee, S. Y. Kim, Y. J. Seo, J. K. Lee, 'An Optimization of Tungsten Plug Chemical Mechanical Polishing (CMP) using Different Consumables', Journal of Materials Science : Materials in Electronics, Vol. 12, No. 1, p, 63, 2001 https://doi.org/10.1023/A:1011276830620
  8. Y. J. Seo, W. S. Lee, J. S. Park and S. Y. Kim, 'Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry', Japanese Journal of Applied Physics, Vol. 42, No. 10, p. 6396, 2003 https://doi.org/10.1143/JJAP.42.6396
  9. Y. J. Seo, W. S. Lee, P. Yeh, 'Improvements of oxide-chemical mechanical polishing performances and aging effect of alumina and silica mixed abrasive slurry', Microelectronic Engineering, Vol. 75, No. 4, pp. 361-366, 2004 https://doi.org/10.1016/j.mee.2004.07.062
  10. 서용진, 박성우, '졸겔법에 의해 제작된 강유전체 BST막의 기계화학적인 연마 특성', 대한전기학회 논문지, 제53C권 제3호, pp.128-132, 2004
  11. 서용진, 고필주, 박성우, 이강연, 이우선, '고집적 메모리 커패시터의 Vertical Sidewall Patterning을 위한 BTO 박막의 CMP 특성', 대한전기학회 논문지, 제55C권 제3호, pp.116-121, 2006
  12. N. H. Kim, P. J. Ko, Y. J. Seo and W. S. Lee, 'Chemical Mechanical Polishing Characteristics of PZT Thin Film for Ferroelectric Memory Applications' Proceeding of ICAMD-2005, p.377, 2005.12