Journal of Welding and Joining

  • 제24권2호
  • /
  • Pages.34-41
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  • 2006
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

MEMS 기술을 이용한 마이크로 전자 패키징 기술

Application of MEMS Technology in Microelectronic Packaging

  • 김종웅 (성균관대학교 신소재공학과) ;
  • 김대곤 (성균관대학교 신소재공학과) ;
  • 문원철 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 문정훈 (수원과학대학 일렉트로닉스패키징과) ;
  • 서창제 (성균관대학교 신소재공학과) ;
  • 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
  • 발행 : 2006.04.01
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초록

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참고문헌

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  2. J.H. Lau : Low Cost Flip Chip Technologies, McGraw-Hill, 2001, 1-17, 27-90
  3. J.W. Kim, D,G. Kim, W.S. Hong, S.B. Jung : Evaluation of Solder Joint Reliability in Flip Chip Packages during Accelerated Testing, Journal of Electronic Materials, 34, (2005), 1550-1557 https://doi.org/10.1007/s11664-005-0164-8
  4. R. Nayve, M, Fujii, A. Fukugawa, T. Takeuchi, M. Murata, Y. Yamada, M. Koyanagi : High-Resolution Long-Array Thermal Ink Jet Printhead Fabricated by Anisotropic Wet Etching and Deep Si RIE, Journal of Microelectromechanical Systems, 13, (2004), 814-821 https://doi.org/10.1109/JMEMS.2004.835785
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