Progress in Superconductivity
- 제7권2호
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- Pages.145-151
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- 2006
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- 1229-4764(pISSN)
구리 기판에 전착시킨 니켈과 니켈합금의 집합조직 형성
Texture Formation of Eletroplated Nickel and Nickel Alloy on Cu Substrate
- Kim, Jae-Geun (Korea Polytechnic University) ;
- Lee, Sun-Wang (Korea Polytechnic University) ;
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Kim, Ho-Jin
(Korea Polytechnic University) ;
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Hong, Gye-Won
(Korea Polytechnic University) ;
- Lee, Hee-Gyoun (Korea Polytechnic University)
- 발행 : 2006.04.01
초록
Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at