Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 13 Issue 1 Serial No. 38
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- Pages.1-5
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- 2006
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Property of Composite Titanium Silicides on Amorphous and Crystalline Silicon Substrates
아몰퍼스실리콘의 결정화에 따른 복합티타늄실리사이드의 물성변화
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Song Oh-Sung
(Department of Materials Science and Engineering, The University of Seoul) ;
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Kim Sang-Yeob
(Department of Materials Science and Engineering, The University of Seoul)
- Published : 2006.03.01
Abstract
We prepared 80 nm-thick TiSix on each 70 nm-thick amorphous silicon and polysilicon substrate using an RF sputtering with
반도체 메모리 소자의 스피드 향상을 위해 저저항 배선층을 채용하는 방안으로 70 nm-두께의 아몰퍼스실리콘과 폴리실리콘 기판부에