Journal of Mechanical Science and Technology

  • 제20권1호
  • /
  • Pages.76-84
  • /
  • 2006
  • /
  • 1738-494X(pISSN)
  • /
  • 1976-3824(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
권호 표지

The Influences of Residual Stress on the Frequency of Ultrasonic Transducers with Composite Membrane Structure

  • Lee Seungmock (Technology Research Institute of Osaka Prefecture) ;
  • Kim Jong-Min (School of Mechanical Engineering, Chung-Ang University) ;
  • Shin Young-Eui (School of Mechanical Engineering, Chung-Ang University)
  • 발행 : 2006.01.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Arrayed ultrasonic sensors based on the piezoelectric thin film (lead-zirconate-titanate: Pb($Zr_{0.52}Ti_{0.48})O_{3}$) having composite membrane structure are fabricated. Different thermal and elastic characteristics of each layer generate the residual stress during the high temperature deposition processes, accomplished diaphragm is consequently bowing. We present the membrane deflection effects originated from the residual stress on the resonant frequencies of the sensor chips. The resonant frequencies ($f_r$) measured of each sensor structures are located in the range of $87.6{\sim}111\;kHz$, these are larger $30{\sim}40\;kHz$ than the resultant frequencies of FEM. The primary factors of $f_r$ deviations from the ideal FEM results are the membrane deflections, and the influence of stiffness variations are not so large on that. Membrane deflections have the effect of total thickness increase which sensitively change the $f_r$ to the positive direction. Stress generations of the membrane are also numerically predicted for considering the effect of stiffness variations on the $f_r$.

키워드

참고문헌

  1. Chinmulgund, M., Inturi, R. B. et al., 1995, 'Effect of Ar Gas Pressure on Growth, Structure, and Mechanical Properties of Sputtered Ti, AI, Ti Al, and Ti3Al Films,' Thin Solid Films, Vol. 270, pp.260-263 https://doi.org/10.1016/0040-6090(95)06990-9
  2. Fitch, J. T., Bjorkman, C. H. et al., 1989, 'Intrinsic Stress and Stress Gradients at the $SiO_2/Si$ Interface in Structures Prepared by Thermal Oxidation of Si and Subjected to Rapic Thermal Annealing,' J. Vac. Sci. Technol. B, Vol. 7, No. 4, pp. 775-781 https://doi.org/10.1116/1.584599
  3. Gauthier, M. M., 1995, Engineering Materials Handbook (ASM desk edt.), Materials Park, OH
  4. Harms, U., Kempen L. et al., 1998, 'Influence of Stress in Thin Film Modulus Measurements by the Vibrating Reed Technique,' Thin Solid Films, Vol. 323, pp. 153-157 https://doi.org/10.1016/S0040-6090(97)01026-2
  5. Harris, C. M., 1995, Shock and Vibration Handbook (4th Edt.), McGraw-Hill, New York, pp.7.25-7.49
  6. Hess, P., 1996, 'Laser Diagnostics of Mechanical and Elastic Properties of Silicon and Carbon Films,' Appl. Surf Sci., Vol. 106, pp.429-437 https://doi.org/10.1016/S0169-4332(96)00369-8
  7. Hwang, H. Y., Kim, Y. K., Kim, C., Kwon, Y. -D. and Choi, W., 2003, 'Thermo-Viscoelastic Residual Stress Analysis of Metal Linear- Inserted Composite Cylinders,' KSME International Journal, Vol. 17, No.2, pp. 171-180 https://doi.org/10.1007/BF02984387
  8. Irene, E. A. and Tierney, E., 1982, 'A Viscous Flow Model to Explain the Appearance of High Density Thermal $SiO_2$ at Low Oxidation Temperatures,' J. Electrochem. Soc., Vol. 129, No. 11, pp.2594-2597 https://doi.org/10.1149/1.2123617
  9. Katz, A. and Dautremont-Smith, W. C., 1990, 'Stress Measurements of $Pt/Ti/SiO_2/inP$ Systems: In Situ Measurements Through Sintering and After Rapid Thermal Processing,' J. Appl. Phys., Vol. 67, No. 10, pp. 6237-6246 https://doi.org/10.1063/1.345190
  10. Kim, M. T., 1996, 'Influence of Substrates on the Elastic Reaction of Films for the Microindentation Tests,' Thin Solid Films, Vol. 283, pp.12-16 https://doi.org/10.1016/0040-6090(95)08498-3
  11. Low, T. S. and Guo, W., 1995, 'Modeling of a Three-Layer Piezoelectric Bimorph Beam with Hysteresis,' J. MEMS, Vol. 4, No.4, pp.234-237 https://doi.org/10.1109/84.475550
  12. Mo, Y., Tanaka, T., Inoue, K. et al., 2003, 'Front-End Processor Using BBD Distributed Delay-Sum Architecture for Micromachined Ultrasonic Sensor Array,' J. MEMS, Vol. 12, No. 12, pp. 506-512 https://doi.org/10.1109/JMEMS.2003.815840
  13. Nayfeh, S. A., 0000, 'Damping of flexural vibration in the plane of lamination of elasticviscoelastic sandwich beams,' J. Sound and Vibration, in press
  14. Okuyama, M., 2001, 'Electronic devices using the ferroelectric thin film,' T. IEE Japan, Vol. 121-E, pp. 537-541. (in Japanese)
  15. Pietrzakowski, M., 2001, 'Active Damping of Beams by Oiezoelectric System : Effects of Bonding Layer Properties,' Int. J. Solids and Structures, Vol. 38, pp. 7885-7897 https://doi.org/10.1016/S0020-7683(01)00105-6
  16. Sengupta, S. S., Park, S. M. et al., 1998, 'Origins and Evolution of Stress Development in SolGel Derived Thin Layers and Multideposited Coatings of Lead Titanate,' J. Appl. Phys., Vol. 83, No.4, pp. 2291-2296 https://doi.org/10.1063/1.366971
  17. Spierings, G. A. C. M., Dormans, G. J. M. et aI., 1995, 'Stresses in $Pt/Pb(Zr, Ti)O_3/Pt$ ThinFilm Stacks for Integrated Ferroelectric Capacitors,' J. Appl. Phys., Vol. 78, No.3, pp. 1926-1933 https://doi.org/10.1063/1.360230
  18. Sze. ed, S.M., 1994, Semiconductor Sensors, Wiley Inter-Science, New York
  19. Timosenko, S. and Woinowsky-Krieger, S., 1959, Theory of Plates and Shells ($2^nd$ Edt.), McGraw-Hill, New York, pp. 30
  20. Townsend, P. H., Barnett D. M. et al., 1987, 'Elastic Relationships in Layered Composite Media with Approximation for the Case of Thin Films on a Thick Substrate,' J. Appl. Phys., Vol. 62, No. 11, pp. 4438-4444 https://doi.org/10.1063/1.339082