In-Plane Deformation Analysis and Design of Experiments Approach for Injection Molding of Light Guide Plate for LCDs

  • Lee Ho-Sang (Department of Mechanical Design Engineering, Chungju National University)
  • Published : 2006.01.01

Abstract

A computer code was developed to simulate both the thermal stresses introduced during the post-filling stage and the in-plane deformation after ejection process by finite element method based on the plane stress theory. The computer simulation was applied to the mold design of a 2 inch light guide plate (LGP) for thin film transistor (TFT)-liquid crystal displays (LCD). With injection molding experiments based on the design of experiments (DOE) technique, the influences of the processing conditions in injection molding on brightness and uniformity of the LGP were investigated, and the optimal processing parameters were selected to increase the brightness and uniformity. The verification experiment showed that the brightness and uniformity of the LGP were increased dramatically under the selected optimal processing conditions.

Keywords

References

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