한국재료학회지 (Korean Journal of Materials Research)

  • 제16권11호
  • /
  • Pages.710-714
  • /
  • 2006
  • /
  • 1225-0562(pISSN)
  • /
  • 2287-7258(eISSN)
한국재료학회 (Materials Research Society of Korea)
권호 표지
DOI QR코드

DOI QR Code

구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과

The Effect of Hydroxy Ethyl Cellulose(HEC) on the Surface Morphology and Mechanical Characteristis of Copper Electrodeposition

  • 우태규 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 박일송 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 이현우 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 설경원 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터)
  • Woo, Tae-Gyu (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Lee, Hyun-Woo (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
  • 발행 : 2006.11.27
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

키워드

참고문헌

  1. S. H Kim, D. W. Lee and K. H. Chung, Kor. J. Mater. Res., 9, 65 (1999)
  2. M. M. D. Ramos, A. M. Stoncham and A. P. Sutton, Acta metall. mater, 41, 2105 (1993)
  3. R. R. Tummala and E. J. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, (1989)
  4. A. P. Payne and B. M. Clemens, J. Mater. Res., 7, 1370 (1992) https://doi.org/10.1557/JMR.1992.1370
  5. A. G Dirks and J. J. van den Broek, J. Vac. Sci. Technol., A3, 2618 (1985) https://doi.org/10.1116/1.572799
  6. C. J. Wang, C. A. Chang, C. E. Farrel and A. G Schrott, Appl, Phys. Lett., 62, 654 (1993) https://doi.org/10.1063/1.108888
  7. J. Kim, S. H. Wen and D. Yee, J. Vac. Sci. Technol., A6, 2366 (1988) https://doi.org/10.1116/1.575557
  8. T. X. Liang, Y. Q. Liu, Z. Q. Fu, Z. Q. Luo and K. Y. Zhang, This Solid films, 473, 247 (2005) https://doi.org/10.1016/j.tsf.2004.07.073
  9. C. H. Yang, S. C. Lee, J, M. Wu and T. C. Lin, Appl, Surface Sci., 252, 1818 (2005) https://doi.org/10.1016/j.apsusc.2005.03.182
  10. J. L. Vossen and Werner Kern, Thin film process Academc press, New York, San Francisco, London (1978)
  11. M. L. Sartorelli, A. Q. Schervenski, R. G. Delatorre and P. Klauss, Phys. stat. sol, 187, 91 (2001) https://doi.org/10.1002/1521-396X(200109)187:1<91::AID-PSSA91>3.0.CO;2-9
  12. R. Haight, R. C. White, B. D. Silverman and P. S. Ho, J. Vac. Sci. Technol., A, Vac. Surf. Films, 6, 2188 (1988) https://doi.org/10.1116/1.575010
  13. D. S. Dunn and J. L. Grant, J. Vac. Sci. Technol., A, Vac. Surf. Films, 7, 253 (1989) https://doi.org/10.1116/1.576128
  14. S. H. Kim, S. W. Na, N. E. Lee, Y. W. Nam and Y. H. Kim, Surf. Coat. Technol., 200, 2072 (2005) https://doi.org/10.1016/j.surfcoat.2005.05.021
  15. H. S. Lee, H. S. Kim and C. M. Lee, J. Kor. Inst. Met. & Mater., 39, 920 (2001)
  16. T. Fukada, M. Hasegawa, Y. Toyda, K. Sato, M. Nunoshita and H. Kotani, Ext. Abs. 53rd Autumn Meeting, Jpn. Soc. Appl, Phys., 18p-ZR-3 (1992)
  17. J. Li. Y. Shacham-Diamond, J. W. Mayer and E. G. Colgan, Proc. VMIC Coference, 153 (1991) https://doi.org/10.1109/VMIC.1991.152979
  18. H. J. Lee. Ph.D. Thesis, P. 4, Seoul National University, Seoul (2003)
  19. H. J. Kang, P. N. Park, S. J. Park and S. Y. Choi, Electro. Technol. Res., 203, 8 (2003)

피인용 문헌

  1. Crystallographic Effects of Anode on the Mechanical Properties of Electrochemically Deposited Copper Films vol.26, pp.12, 2016, https://doi.org/10.3740/MRSK.2016.26.12.714