Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
권호 표지

Signal transient simulation of multi-coupledm frequency-variant transmission lines

주파수 종속 다중 전송선의 신호 천이 특성

  • Cho, Young-Il (Hanyang University, Dep. Of Electrical and Computer Engineering) ;
  • Eo, Yung-Seon (Hanyang University, Dep. Of Electrical and Computer Engineering)
  • 조영일 (한양대학교 전자컴퓨터공학) ;
  • 어영선 (한양대학교 전자컴퓨터공학)
  • Published : 2006.12.25
Download PDF
⟨ Previous Next ⟩

Abstract

Frequency-variant transmission line parameters are determined. Then the signal transient characterizations of frequency-dependent multi-coupled lines are investigated. With the proposed method, an accurate signal integrity degradation such as signal ringing (overshoot, undershoot) and crosstalk noises relevant to the switching patterns of signals, rising / falling time(tr, tf) and line lengths is investigated. It is shown that there may be approximately 26% discrepancy of signal transients and 260% difference of crosstalk noises between the constant RLC model and frequency-variant RLC model in on-chip global interconnects while those of package lines are 11% and 70%, respectively.

다중 배선의 주파수 변화에 따른 전송전 파라미터를 계산하고 이를 이용하여 다증 배선의 주파수 종속 신호 천이 특성을 조사한다. 제시한 방법으로 다중 배선 입력신호의 스위칭 패턴, 상승 / 하강시간 (tr, tf) 및 길이에 따른 신호의 흔들림 (오버슛, 언더슛)과 크로스톡에 고주파 효과를 반영하여 시그널 인테그러티를 정확하게 결정할 수 있다. 고속 디지털 회에서 주파수 종속 특성을 고려하지 않으면 최악의 신호 동작 환경에서 글로벌 배선의 경우 26%와 260%, 패키지 배선은 11%와 70% 정도의 신호 천이와 크로스톡 노이즈 오차를 갖을 수 있다는 것을 보인다.

Keywords

References

  1. 'International Technology Roadmap for Semiconductors,' SIA Report, 2003
  2. A. Deutsch et al., 'When are transmission-line effects important for on-chip interconnections?,' IEEE Trans. Microwave Theory Tech, vol. 45, pp. 1836-1997, Oct. 1997 https://doi.org/10.1109/22.641781
  3. A. Deutsch et al., 'On-chip wiring design challenges for gigahertz operation,' Pro. IEEE, vol. 89, pp. 529-555, Apr. 2001 https://doi.org/10.1109/5.920582
  4. Y. I. Ismail, E. G. Friedman, and J. L. Neves, 'Equivalent Elmore delay for RLC trees,' IEEE Trans. Computer-Aided Design, vol. 19, pp. 83-97, Jan. 2000 https://doi.org/10.1109/43.822622
  5. Y. Cao et al., 'A new analytical delay and noise model for on-chip RLC interconnect,' in Proc Int. Electron Devices Meeting (IEDM), pp.823-826, Dec. 2000 https://doi.org/10.1109/IEDM.2000.904444
  6. R. Venkatesan, J. A. Davis, and J. D. Meindl, 'Compact distributed RLC interconnect models-part III:transients in single and coupled lines with capacitive load termination,' IEEE Trans. Electron Devices., vol. 50, pp.1081-1093, Apr. 2003 https://doi.org/10.1109/TED.2003.812507
  7. Enno Grotelschen, Lohit S. Dutta and Zaage, 'Quasi-analytical analysis of the broadband properties of multiconductor transmission lines on semiconducting substrates,' IEEE Trans. Components, Packaging, Manufact. Tech., vol. 17, pp.376-382, Aug. 1994 https://doi.org/10.1109/96.311787
  8. Enno Grotelschen, Lohit S. Dutta and Zaage, 'Full-wave analysis and analytical formulas for the line parameters of transmission lines on semiconductor substrates,' INTERGRATION, VLSI J., vol. 16, pp.33-58, 1993 https://doi.org/10.1016/0167-9260(93)90057-J
  9. Uwe Arz, Hartmut. Grabinski and Dylan F. Williams, 'Influence of the substrate resistivity on the broadband propagation characteristics of silicon transmission lines,' US Government work
  10. Howard W. Johnson and Martin Graham, 'High-speed digital design (A handbook of black magic),' Prentice Hall PTR, New Jersey, pp.151-155, 1993
  11. S. Shin and Y. Eo, 'Non-physical pseudo-wave- based modal decoupling technique of multi-coupled co-planar transmission lines with homogeneous dielectric media,' in Proc. ISQED., vol. 7, pp. 278-283, Mar. 2006 https://doi.org/10.1109/ISQED.2006.92
  12. Y. Eo and W. R. Eisenstadt, 'Generalized coupled interconnect transfer function and high-speed signal simulations,' IEEE Trans. Microwave Theory Tech.,vol. 43, pp. 1115-1121, May 1995 https://doi.org/10.1109/22.382074
  13. H. You and M. Soma, 'Crosstalk analysis of interconnection lines and packages In high-speed integrated circuits,' IEEE Trans. Circuits Syst., vol. 37, pp, 1019-1026, Aug. 1990 https://doi.org/10.1109/31.56075
  14. H. You and M. Soma, 'Crosstalk analysis of high-speed interconnects and packages,' IEEE Trans. Custom Integrated Circuits Conf., May. 1990 https://doi.org/10.1109/CICC.1990.124711
  15. Y. Ikawa, W. R. Eisenstadt, and R. W. Dutton, 'Modeling of high-speed, large-signal transistor switching transients form S-parameter measurements,' IEEE Trans. Electron Devices, vol. ED 29, pp. 669-675, Apr. 1982 https://doi.org/10.1109/T-ED.1982.20760
  16. Y. Eo and W. R. Eisenstadt, 'S-parameter-measurement-based high-speed signal transient characterization of VLSI interconnects on SiO2-Si substrate,' IEEE Trans. Adv. Packag., vol. 23, pp.470-479, Aug. 2000 https://doi.org/10.1109/6040.861562
  17. Y. Eo and W. R. Eisenstadt, 'Simulation an measurements of picosecond signal transients, propagation, and crosstalk on lossy VLSI interconnect,' IEEE Trans. Comp., Packag., Manuaa, Technol. B, vol. 18, pp.215-225, Mar. 1995 https://doi.org/10.1109/95.370758
  18. K.D.Granzow, Digital Transmission Lines, New York: Oxford Univ, Press, pp.133-168, 1998