대한소아치과학회지 (Journal of the korean academy of Pediatric Dentistry)
- 제33권3호
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- Pages.422-428
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- 2006
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- 1226-8496(pISSN)
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- 2288-3819(eISSN)
7세대 결합제의 미세누출에 관한 연구
MICROLEAKAGE OF 7TH GENERATION BONDING SYSTEM
- 이상엽 (원광대학교 치과대학 소아치과학교실) ;
- 김대업 (원광대학교 치과대학 소아치과학교실) ;
- 라지영 (원광대학교 치과대학 소아치과학교실) ;
- 이광희 (원광대학교 치과대학 소아치과학교실)
- Lee, Sang-Yup (Department of Pediatric Dentistry, College of Dentistry, Wonkwang University) ;
- Kim, Dae-Eup (Department of Pediatric Dentistry, College of Dentistry, Wonkwang University) ;
- Ra, Ji-Young (Department of Pediatric Dentistry, College of Dentistry, Wonkwang University) ;
- Lee, Kwang-Hee (Department of Pediatric Dentistry, College of Dentistry, Wonkwang University)
- 발행 : 2006.08.31
초록
상아질 접착제는 많은 발전을 거듭하여 적용 단계가 단순화되고 짧아져서 어린이에게 사용하기에 더욱 편리해졌다. 본 연구에서는 최근 개발된 7세대 결합제인
Dentin bonding system have recently been developed in an effort to simplify and shorten bonding procedure. The intent of this study was to evaluate microleakage of newer generation of dentin bonding system comparing with other generations. Forty extracted human premolar teeth were randomly assigned to four groups for bonding : the 4th generation bonding system (Scotchbond Multi-Purpose). the 5th generation bonding system (Clearfil SE Bond), 6th generation bonding system (AQ bond) and 7th generation bonding