Journal of Welding and Joining

  • 제23권2호
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  • Pages.41-46
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  • 2005
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

다이아몬드를 이용한 차세대 마이크로 전자에미터 패키징

Research for the Micro Packaging of Diamond Electron Emitter

  • 이승목 (오사카부립 산업기술총합연구소) ;
  • 김종민 (중앙대학교 기계공학부)
  • 발행 : 2005.04.01
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초록

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참고문헌

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