실리콘 미세구멍가공기술에 관한 연구

A Study on the Micro Hole Drilling of Silicon

  • 허찬 (금오공과대학교 대학원 기계설계공학과) ;
  • 이창규 (금오공과대학교 대학원 기계설계공학과) ;
  • 채승수 (금오공과대학교 대학원 기계설계공학과) ;
  • 박세진 (금오공과대학교 대학원 기계설계공학과) ;
  • 이종찬 (금오공과대학교 기계공학부)
  • 발행 : 2005.03.30

초록

This paper reports experimental results on microdrilling process for silicon parts used in semiconductor equipments. An experimental system was developed consisting of a high speed precision machine, microscope system, and project profile instrument. The experimental results indicate that the amount of chipping at the entrance and exit of micro hole decreases as the spindle speed increases up to 18,000 rpm. At higher spindle speed, however, the amount of chipping increases rapidly. The amount of chipping and infeed rate show proportional relationship up to 20 m/min of infeed rate. Beyond that infeed rate, however, sudden increase in the amount of chipping has occurred.

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