Synthesis and Properties of Photocurable Dipentaerythritol Modified Polymethacrylates

광경화형 Dipentaerythritol 변성 폴리메타아크릴레이트의 합성과 물성

  • Kim, Dong Kook (Department of Chemistry & Material Science, Hanyang University) ;
  • Lim, Jin Kyu (Department of Chemistry & Material Science, Hanyang University) ;
  • Kim, Woo Geun (Department of Chemistry & Material Science, Hanyang University) ;
  • Haw, Jung Rim (Department of Materials Chemistry & Engineering, Konkuk University)
  • 김동국 (한양대학교 신소재 화학과) ;
  • 임진규 (한양대학교 신소재 화학과) ;
  • 김우근 (한양대학교 신소재 화학과) ;
  • 허정림 (건국대학교 신소재 공학과)
  • Received : 2004.08.18
  • Accepted : 2004.11.30
  • Published : 2005.02.10

Abstract

Photocurable modified 6 functional polyacrylate(PA-1) were prepared from dipentaerythritol derivatives (DPET) and acrylic acid, and 12 functional polymethacrylate(PA-2) were prepared from dipentaerythritol derivatives (DPET), trimellitic anhydride, and glycidyl methacrylate. And physical properties of photocurable modified poly(meth)acrylate were increased with increasing functionality of (meth)acrylate. Thermal stability of UV cured film obtained by using TGA was shifted to higher temperature as the increasing of functionality. Hardness, abrasion resistance and tensile strength of UV cured film were increased with increasing functionality of (meth)acrylate. Values of yellow index were increased with increasing functionality of (meth)acrylate.

Dipentaerythritol 유도체(DPET)와 acrylic acid를 반응하여 6관능 광경화형 변성 폴리아크릴레이트(PA-1)를 제조하였으며, dipentaerythritol 유도체(DPET)에 trimellitic anhydride와 glycidyl methacrylate를 반응시켜 12관능 광경화형 변성 폴리메타아크릴레이트(PA-2)를 제조하고 경화된 물성을 조사하였다. 관능기 수가 증가할수록 중량 평균 분자량은 증가하였으며, TGA (Thermogravimetric Analyzer)로 측정한 UV 경화필름의 열안정성은 (메타)아크릴레이트의 관능기 수가 많을수록 증가하였다. 또한 (메타)아크릴레이트의 관능기 수가 많을수록 경도, 내마모성, 인장강도가 우수하였으며, 내후성 테스트에서는 (메타)아크릴레이트의 관능기 수가 많을수록 황변 지수 값인 yellow index 값이 높아지는 결과를 보여주었다.

Keywords

References

  1. Y. Kim, J. Polym. Sci., Part A: Polym. Chem., 36, 1685 (1998) https://doi.org/10.1002/(SICI)1099-0518(199808)36:11<1685::AID-POLA1>3.0.CO;2-R
  2. B. Voit, J. Polym. Sci., Part A: Polym. Chem., 38, 2505 (2000) https://doi.org/10.1002/1099-0518(20000715)38:14<2505::AID-POLA10>3.0.CO;2-8
  3. M. Johansson and A. Huh, J. Coatings Technology, 67, 35 (1995)
  4. H. Huang, J. Zhang, and W. Shi, J. Photopolym. Sci. Tech., 10, 341 (1997) https://doi.org/10.2494/photopolymer.10.341
  5. H. Wei, H. Kou, W. Shi, H. Yuan, and Y. Chen, Polymer, 42, 6741 (2001) https://doi.org/10.1016/S0032-3861(01)00139-2
  6. M. Johansson, T. Glauser, G. Rospo, and A. Huh, J. Appl. Polym. Sci., 75, 612 (2000) https://doi.org/10.1002/(SICI)1097-4628(20000131)75:5<612::AID-APP3>3.0.CO;2-1
  7. H. Wei, Y. Lu, W. Shi, H. Yuan, and Y. Chen, J Appl. Polym. Sci., 80, 51 (2001) https://doi.org/10.1002/1097-4628(20010404)80:1<51::AID-APP1074>3.0.CO;2-W
  8. R. Kaneko, M. Jikei, and M. Kakimoto, High Performance Polymers, 14, 53 (2002) https://doi.org/10.1177/0954008302014001451
  9. H. Kou, A. Asif and W. Shi, European Polymer Journal, 38, 1931 (2002)
  10. S. W. Zhu and W. Shi, Polym. Int., 51, 223 (2002) https://doi.org/10.1002/pi.827
  11. W. Huanyu, K. Huiguang, and W. Shi, J. Coatings Technology, 75, 939 (2003)
  12. M. Braithwaite, S. Davidson, R. Holman, C. Lowe, P. K. T. Oldring, M. S. Salim, and C. Wall, Chemistry & Technology of UV & EB Formulation for Coatings, Inks & Paints, ed. P. K. T. Oldring, SITA Technology, London (1991)
  13. S. P. Pappas, Radiation Curing, Plenum Press, New York (1992)
  14. S. P. Pappas, UV Curing: Science and Technology, Technology Marketing Corporation, Connecticut (1983)
  15. J. C. Jung, Polymer(Korea), 10, 570 (1986)
  16. C. E. Hoyle and J. F. Kinstle, Radiation Curing of Polymeric Materials, American Chemical Society, Washigton DC (1990)
  17. G. Orcel, S. Vanpoulle, J. Y. Barraud, J. Y. Boniort, and B. Overton, Wire, 46, 206 (1996)
  18. A. H. Rodas, R. E. S. Bretas, and A. Reggianni, J. Mater. Sci., 21, 3025 (1986) https://doi.org/10.1007/BF00553332
  19. M. J. Moon, J. H. Park, and G. D. Lee, J. Korean Ind. Eng. Chem., 2, 175 (1991)
  20. J. K. Lim, D. K. Kim, and J. Y. Hwang, J. Korean Ind. Eng. Chem., 14, 818 (2003)
  21. J. K. Lim, D. K. Kim, and W. G. Kim, J. Korean Ind. Eng. Chem., 15, 225 (2004)
  22. Y. C. Kim and B. J. Lee, J. Korean Ind. Eng. Chem., 13, 538 (2002)
  23. J. W. Hong, M. Y. Park, H. K. Kim, Y. B. Kim, and H. K. Choi, J. Korean Ind. Eng. Chem., 11, 693 (2000)
  24. J. W. Hong and H. W. Lee, J. Korean Ind. Eng. Chem., 5, 857 (1994)
  25. J. K. Lim, D. K. Kim, and W. G. Kim, J. Korean Ind. Eng. Chem., 15, 360 (2004)