Effect of Adhesives and Finger Pitches on Bending Creep Performances of Finger-Jointed Woods

  • Park, Han-Min (College of Agriculture & Life Science, Institute of Agriculture & Life Science, Gyeongsang Nat'l Univ.) ;
  • Oh, Seong-Won (College of Agriculture, Chonbuk National University) ;
  • Byeon, Hee-Seop (College of Agriculture & Life Science, Institute of Agriculture & Life Science, Gyeongsang Nat'l Univ.)
  • Received : 2005.04.04
  • Accepted : 2005.07.08
  • Published : 2005.09.25

Abstract

Following our previous reports for finger-jointed woods with various finger profiles studied for the efficient use of small diameter logs and woods containing various defects, twelve types of finger-jointed woods glued with three kinds of adhesives and with two sizes of finger pitches were made with sitka spruce and red pine. The effects of the adhesives and finger pitches on bending creep performances of finger-jointed woods were investigated. The shape of creep curves differed among the used adhesives and finger pitches of finger-jointed woods for both tested species. Their creep curves showed a linear behavior beyond about one hour, and the N values fitted to power law increased with increasing finger pitches. The initial deformation increased with increasing finger pitches, regardless of the tested species and kinds of adhesives, whereas the effect of finger pitches on the creep deformation was not clear. For finger-jointed woods glued with polyvinyl acetate (PVAc) resin, creep failure occurred in 106 hours after the load was applied. And the difference of the creep compliance between finger-jointed woods glued with resorcinol-phenol formaldehyde (RPF) resin and aqueous vinyl urethane (AVU) resin was small. The ratios for creep performances of finger-jointed woods glued with RPF resin and AVU resin versus solid wood were higher in creep deformation than initial deformation for both species, and the difference between both adhesives was not found. The relative creep decreased with increasing finger pitches, and the marked differences was not found between RPF resin and AVU resin.

Keywords

References

  1. Aratake, S., H. Morita, and T. Arima. 2002. Creep of various structural members in ambient conditions I. Estimation of future deflections considering the longevity of wooden structures. Mokuzai Gakkaishi 48(4): 233 -240
  2. Arima, T., M. Sato, and K. Mashita. 1981. Studies on evaluation method for long-term performance of wood-based materials and elements. Report of the Building Research Institute No.95: 25-80
  3. Bryan, E. L. and A. P. Schniewind. 1965. Strength and rheological properties of particleboard. Forest Prod J 15(4): 143-148
  4. Byeon, H. S., H. M. Park, and J. M. Kim. 1997. Improvement of bending performances by slope finger-jointed method in Pinus densiflora S. et Z.(I). Mokchae Konghak 25(4): 61-67
  5. Fushitani, M. and Y. Bono. 1975. Bending creep of laminated woods. Wood Industry, Japan 30(5): 22-24
  6. Hong, S. I. and T. Arima. 1993. Creep of nailplate-jointed glulams and solid glulams under changing humidity. Mokuzai Gakkaishi 39(9):1020-1026
  7. Hoyle, R. J., R. Y. Ttani, and J. T. Anderson. 1994. The effect of moisture cycling on creep of small glued laminated beams. Wood Fiber Sci 26(4): 556-562
  8. Kitahara, K. and W. T. Pemg. 1965. On the creep of hardboard. Mokuzai Gakkaishi 11(6): 88-92
  9. Moriizumi, S. 1981. Creep properties of woodbased boards under plate shear. Journal of the Hokkaido Forest Products Research Institute No. 359: 6-14
  10. Moslemi, A. A. 1964. Some aspects of viscoelastic behavior of hardboard. Forest Prod J 14(8): 337 - 342
  11. Nakai, T. 1978. Bending creep test on woodbased boards II. Wood Industry, Japan 33(6):247-249
  12. Park, H. M., G. P. Lee, T. S. Kong, H. S. Ryu, and H. S. Byeon. 2004. Effect of finger profile on static bending strength performance of fingerjointed wood. Mokchae Konghak 32(6) : 57-66
  13. Park, H. M., M. Fushitani, K. Sato, T. Kubo, and H. S. Byeon. 2002. Bending creep performances of cross-laminated sugi wood. Mokuzai Gakkaishi 48(3): 166-177
  14. Ryu, H. S., S. Y. Ahn, G. P. Lee, H. M. Park, and H. S. Byeon. 2003. The bending strength properties and acoustic emissions to the difference of finger widths. Mokchae Konghak 31(2): 84-91
  15. Saito, F, M. Ikeda, and K. Ogawa. 1980. Timerelated flexural behaviour of particleboards under long term load. Mokuzai Gakkaishi 26(11): 714-718
  16. Schniewind, A. P. 1968. Recent progress in the study of the rheology of wood. Wood Sci Technol 2: 188-206 https://doi.org/10.1021/es60015a604