Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지

Low Temperature Bonding Process of Silicon and Glass using Spin-on Glass

Spin-on Glass를 이용한 실리콘과 유리의 저온 접합 공정

  • 이재학 (한국과학기술원 기계공학과) ;
  • 유중돈 (한국과학기술원 기계공학과)
  • Published : 2005.12.01
Download PDF
⟨ Previous Next ⟩

Abstract

Low temperature bonding of the silicon and glass using the Spin-on Glass (SOG) has been conducted experimentally to figure out the effects of the SOG solution composition and process variables on bond strength using the Design of Experiment method. In order to achieve the high quality bond interface without rack, sufficient reaction time of the optimal SOG solution composition is needed along with proper pressure and annealing temperature. The shear strength under the optimal SOG solution composition and process condition was higher than that of conventional anodic bonding and similar to that of wafer direct bonding.

Keywords

References

  1. C. J. Brinker and G. W. Scherer: Sol-Gel processing), Academic press, 1990
  2. A. C. Pierre: Introduction to Sol-Gel processing, Kluwer academic publishers, 1998
  3. H. C. Lin et al.: Low temperature wafer bonding by spin on glass, American Vacuum Society, 20-2 (2002), 752-754
  4. M. Alexe et al.: Low temperature Ga/Si direct wafer bonding, Electronics Letters, 36-7(2000), 677-678 (in English)
  5. R. Gomez et al.: Microfluidic biochip for impedance spectroscopy of biological species, Biomedical Microdevices, 2001, 201-209 https://doi.org/10.1023/A:1011403112850
  6. D.Goustouridis et al.: Low temperature wafer bonding for thin silicon film transfer, Sensors and Actuators A, 110(2004), 401-406 https://doi.org/10.1016/j.sna.2003.09.011
  7. N. N. Toan et al.: Preparation of spin-on glass material using experimental design method, Proceedings of the third International Workshop on Material Science, 1999
  8. 이상복: 알기쉬운 다구찌 기법, 상조사, 2003 (in Korean)
  9. Q.-Y. Tong et al.: Semiconductor wafer bonding (Science and technology), John wiley & Sons, Inc., 1999
  10. H.J.Qenzer et al.: Anodic-bonding on glass layers prepared by a spin-on glass process (preparation process and experimental results), The 11th International Conference on Solid-State Sensors and Actuators, 2001
  11. S.H. Kim et al.: Organosilicate spin-on glass (I .Effect of chemical modification on mechanical properties), Journal of The Electrochemical Society, 2004, F37-F44
  12. S. W. Choi et al.: The analysis of oxygen plasma pretreatment for improving anodic bonding, Journal of the Electrochemical Society, 149-1(2002), G8-G11
  13. M.Wiegand et al.: Wafer bonding of silicon wafers covered with various surface layers, Sensors and Actuators, 2000, 91-95
  14. M. Y. Tsai et al.: A note on Suhir's solution of thermal stresses for a die-substrate assembly, Journal of Electronic Packaging, 126(2004), 115-119 https://doi.org/10.1115/1.1648056