Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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A Study on the CMP of Lithium Tantalate Wafer

Lithium Tantalate (LiTaO3) 웨이퍼의 CMP에 관한 연구

  • 이현섭 (부산대학교 정밀기계공학과) ;
  • 박범영 (부산대학교 정밀기계공학과) ;
  • 서헌덕 (부산대학교 정밀기계공학과) ;
  • 장원문 (부산대학교 정밀기계공학과) ;
  • 정해도 (부산대학교 정밀정형 및 금형가공 연구소)
  • Published : 2005.09.01
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Abstract

Compound semiconductors are the semiconductors composed of more than two chemical elements. Lithium Tantalate$K_I$ wafer is used for several optical devices, especially surface acoustic wave(SAW) device. Because of the lithography in SAW device process, $LiTaO_3$ polishing is needed. In this paper, the commercial slurries $(NALC02371^{TM},\; ILD1300^{TM},\;ceria slurry)$ used for chemical mechanical polishing(CMP) were tested, and the most suitable slurry was selected by measuring material removal rate and average centerline roughness$(R_a)$. From these result, it was proven that $ILD1300^{TM}$ was the most suitable slurry for $LiTaO_3$ wafer CMP due to the chemical reaction between solution in slurry and material.

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References

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Cited by

  1. Analysis of Acoustic Emission Signal Sensitivity to Variations in Thin-film Material Properties During CMP Process vol.38, pp.8, 2014, https://doi.org/10.3795/KSME-A.2014.38.8.863