• Preventive Nutrition and Food Science
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• v.22 no.1
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• pp.30-36
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• 2017

Physicochemical properties of Fujian Yongchun aged vinegar (FYAV) and Shanxi mature vinegar (SMV) were compared in terms of the fermentation methods applied and aging periods (3, 5, 8, and 10 years), and combined E-nose/E-tongue analyses were performed to assess their flavors. Compared with submerged fermentation-derived FYAV, solid-state fermentation-derived SMV showed higher values of pH, brix, soluble solids, total phenolic content, and antioxidant activity, but not total acidity or total organic acids. Aging period resulted in an increase in pH, total phenolic content, and antioxidant activity. Principal component analysis based on E-tongue/E-nose analyses was performed to distinguish between the vinegars produced by different fermentation methods and under aging periods. Solid-state fermentation and an aging process were considered good techniques for vinegar brewing, considering the various organic acids and high levels of total phenolics and antioxidant activity.

• Proceedings of the Korean Magnetic Resonance Society Conference
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• 1999.06a
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• pp.37-37
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• 1999

• Elastomers and Composites
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• v.22 no.2
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• pp.109-120
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• 1987

In this study, as one of the developing ways of the functional elastomer, improvement of the functionality of CB-BR was attemped through stabilization. At first the stabilization effect of CB-BR and the concentration dependancy in CB-BR were determined. Then, triazine thiol derivative(BPTT) was synthesized by reacting p-aminodiphenylamine with cyanuric chloride. Further the functional mechanism and the effects of the antioxidants were investigated using BPTT together with other various antioxidants in liquid and solid states. The results obtained are as follows: 1) The aging of CB-BR depended on the concentration and temperature. Thus, at a low temperature of $50^{\circ}C$, the aging proceeded with gel formation; at high temperature above $100^{\circ}C$ and in above 4wt% concentration, the aging occured by the formation of gel. And in concentrations below that, the aging proceeds with a decomposition caused by oxygen attacked to elastomer molecules. 2) The effect of antioxidation of CB-BR in the liquid state was at it's best when the MBIZ and BPTT were used at $110^{\circ}C$, 4hrs after the oxidation. 3) The effect of antioxidation of CB-BR in the solid state was the best choice the simultaneous use of NDBC and BPTT at $50^{\circ}C$, 30days after the oxidation.

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.271-272
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• 2001

• Journal of Pharmaceutical Investigation
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• v.13 no.1
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• pp.1-9
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• 1983

The effect of humidity on crystallization and polymorphic transformation of hydrous aluminum oxide under various humidity at $37^{\circ}$ was examined by means of X-ray diffraction, scanning electron micrograph, IR spectra and DTA. The humidity was an important factor influencing crystallization of hydrous aluminum oxide. The growth or crystal was strongly accelerated by humidity. The aging process is assumed that it is composed of two seperate steps, an increase of the diffraction around $36{\sim}42^{\circ}$, and an appearance and its development of the peak at $18{\sim}20^{\circ}$ of $2{\theta}$ value. The former is considered to be nucleation and the latter correspond to the growth period on crystallization. The crystalline form of aging products was various depending on the degree of humidity, directly it leads to the eventual formation of bayerite in more than 72%, $b{\"{o}}hmite$ in 50% and resembled to Nordstandite in 0% relative humidity, respectively but once formed, it was mostly stable in each surroundings and does not transform to the other more stable form in solid state even after aging for five years. The mechanism responsible for aging is further polymerization process of six-membered rings by deprotonation-dehydration reaction in which positively charged polynuclear hydroxy aluminum complexes formed in the presence of moisture are joined at their edges by double hydroxide bridges.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.133-137
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• 2003

The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers. This enhanced IMC growth rate was primarily due to the rapid increase In the growth rate of $Cu_6Sn_5$ sublayer. The growth rate of $Cu_3Sn$ sublayers was little influenced and appeared to be retarded by the Bi additions. The observed growth behavior of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers could be understood if the interfacial reaction barrier at the $Cu_6Sn_5/solder$ interface were reduced by the segregation of Bi at the interface.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1725-1727
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• 1998

In this paper the patterns of partial discharges(PD) occurred from some defects at the interface of cable joints as the function of the phase of the applied voltage were investigated in order to discern the kind of a defect. The results obtained in this study show that it is possible to distinguish the PD patterns between the void discharges and the treeing or tracking discharges which were occured at the cable joint interface. While the state of defect transfers from a void discharge into a tree or tracking discharge with a aging time, the skewness for both half of the applied voltage cycle is observed to go to the negative value.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.75-87
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• 2001

Three different kinds of substrate used in this study : bare Cu substrate, Ni-P/Cu substrate with a Ni-P layer thickness of $5\mu\textrm{m},$ and Au/Ni-P/Cu substrate with the Ni-P and Au layers of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness respectively. The wettability of various Sn-base solders was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the Au/Ni-F/Cu substrate, Sn-base solders wet better than any of the other substrate metal finishes tested. The interfacial reaction between various substrate and Sn-base solder was investigated at $70^{\circ}C,$ $100^{\circ}C,$ $120^{\circ}C,$ $150^{\circ}C,$ $170^{\circ}C$ and $200^{\circ}C$ for reaction times ranging from 0 day to 60 day. Intermetallic phases was formed along a Sn-base solder/ various substrate interface during solid-state aging. The apparent activation energy for growth of Sn-Ag/Cu, Sn-Ag-Bi/Cu, and Sn-Bi/Cu couples were 65.4, 88.6, and 127.9 Kj/mol, respectively. After isothermal aging, the fracture surface shoved various characteristics depending on aging temperature and time, and the types of BGA pad.

• Elastomers and Composites
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• v.46 no.2
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• pp.132-137
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• 2011

In the present investigation, thermal aging behavior of H-NBR/NBR blend with various H-NBR content was investigated. Mixture of dicumyl peroxide and sulfur were used as a curing agent. The influence of the thermal aging of the H-NBR/NBR blends on the solid state properties such as tensile strength, elongation at break, hardness and abrasion resistance was investigated. Tensile strength was increased with increasing H-NBR content, while abrasion resistance was decreased. Both elongation at break and hardness were not affected by the addition of H-NBR. The properties such as hardness, tensile strength and elongation at break of the aged samples were lower than unaged samples. However, the rate of deterioration of those properties was decreased by increasing the H-NBR content, which indicated that improved thermal aging behavior was obtained by the addition of H-NBR. Abrasion loss was increased with increasing aging time, but it became less by the addition of H-NBR addition.

• Korean Journal of Materials Research
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• v.30 no.9
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• pp.474-479
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• 2020

The effect of precipitation and dissolution of Si on the thermal diffusivity in the Al-Si alloy system is reported in this study and solution heat treatment followed by aging treatment is carried out to determine the effects of heat treatment on the thermal characteristics. The solution treatment is performed at 535 ℃ for 4 and 10 h and then the specimens are cooled by rapid quenching. The samples are aged at 300 ℃ for 4 h to precipitate Si solute. The addition of 9 wt% silicon contents makes the thermal diffusivity decrease from 78 to 74 mm/s² in the cases of solid solution treated and quenched samples. After quenching and aging, the Si solute precipitates on the Al matrix and increases the thermal diffusivity compared with that after the quenched state. In particular, the increase of the thermal diffusivity is equal to 10 mm/s² without relation to the Si contents in the Al-Si alloy, which seems to corresponded to solute amount of Si 1 wt% in the Al matrix.