환경물질을 제외한 전자부품의 신뢰성평가 방법 연구 -Pb와 Br을 제거한 PWB를 중심으로-

Reliability Assessment Methods for Electronic Component Removed Environmental Materials - focused on Printed Wiring Board without Pb and Br -

  • 이종범 (한국표준협회 신뢰성기술경영연구원) ;
  • 조재립 (경희대학교 산업공학과)
  • Lee Jong-Beom (Reliability Engineering Management Institute, KSA) ;
  • Cho Jai-Rip (Dept. of Industrial Engineering, Kyung-Hee University)
  • 발행 : 2005.06.01

초록

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

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