JSTS:Journal of Semiconductor Technology and Science

  • 제4권3호
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  • Pages.182-188
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  • 2004
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  • 1598-1657(pISSN)
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  • 2233-4866(eISSN)
대한전자공학회 (The Institute of Electronics and Information Engineers)
권호 표지

A System-in-Package (SiP) Integration of a 62GHz Transmitter for MM-wave Communication Terminals Applications

  • Lee, Young-Chul (School of Engineering, Information and Communications University(ICU)) ;
  • Park, Chul-Soon (School of Engineering, Information and Communications University(ICU))
  • 발행 : 2004.09.30
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초록

We demonstrate a $2.1\;{\times}\;1.0\;{\times}\;0.1cm^3$ sized compact transmitter using LTCC System-in-Package (SiP) technology for 60GHz-band wireless communication applications. For low-attenuation characteristics and resonance suppression of the SiP, we have proposed and demonstrated a coplanar double wire-bond transition and novel CPW-to-stripline transition integrating air-cavities as well as novel air-cavities embedded CPW line. The fabricated transmitter achieves an output of 13dBm at a RF frequency of 62GHz, an IF frequency of 2.4GHz, and a LO frequency of 59.6GHz. The up-conversion gain is 11dB, while the LO signal is suppressed with the image rejection mixer below -21.4dBc, and the image and spurious signals are also suppressed below -31dBc.

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참고문헌

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