Abstract
Two phase thermosyphone loop for electronics cooling are designed and manufactured to test its performance under the partial load and low environment temperature conditions. The thermosyphone device has six evaporators connected parallel for the purpose of cooling six power amplifier units (PAU) independently. The heater modules for simulating PAUs are adhered with thermal pad to the evaporator plates to reduce the contact resistance. There are unbalanced distributions of liquid refrigerant in the differently heated evaporators due to the vapor pressure difference. To reduce the vapor pressure differences caused by partial heating, two evaporators are connected each other using the copper tube. The pressure regulation tube successfully reduces these unbalances and it is good candidates for a field distributed systems. Under the low environment temperature operating condition, such as $-30^{\circ}C$, there may be unexpected subcooling in condenser. It leads the very low saturation pressure, and under this condition there exists explosive boiling in evaporator. The abrupt pressure rise due to the explosive boiling inhibits the supplement of liquid refrigerant to the evaporator for continuous cooling. Finally the cooling cycle will be broken. For the normal circulation of refrigerant there may be an optimum cooling air flow rate in condenser to adjust the given heat load.
