대한전기학회논문지:전기물성ㆍ응용부문C (The Transactions of the Korean Institute of Electrical Engineers C)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

필터링에 의한 실리카 슬러리 연마제의 재활용에 관한 연구

A Study on the Recycling of Silica Slurry Abrasives by Filtering

  • 서용진 (대불대학교 전기전자공학과) ;
  • 박성우 (대불대학교 전기전자공학과) ;
  • 이우선 (조선대학교 전기공학과)
  • 발행 : 2004.11.01
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초록

In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

키워드

참고문헌

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