KIEE International Transactions on Electrophysics and Applications

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

Improved Thermal, Structural and Electrical Properties of Elastic-Epoxy Blends System

  • Lee, Kyoung-Yong (School of Electrical, Electronics and Information Engineering, Wonkwang University) ;
  • Lee, Kwan-Woo (School of Electrical, Electronics and Information Engineering, Wonkwang University) ;
  • Choi, Yong-Sung (School of Electrical, Electronics and Information Engineering, Wonkwang University) ;
  • Park, Dae-Hee (School of Electrical, Electronics and Information Engineering, Wonkwang University)
  • 발행 : 2004.10.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

In this paper, epoxy elasticity factors were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microscope) to improve toughness and reduce brittleness of existing epoxy resin. Dumbbell shaped specimens were made and tested at rates of 0, 20 and 35phr (part per hundred resins). TMA temperatures ranged from -2$0^{\circ}C$ to 20$0^{\circ}C$. Tg (glass transition temperature) of elastic epoxy was measured by thermal analysis. Also investigated were thermal expansion coefficient ($\alpha$), modulus and Tan$\delta$ (loss factor). And we analyzed structure through FESEM, could find elastic-factors of elastic epoxy that is not existing-epoxy. In addition, we measured permittivity and Tan$\delta$ for investigation of the electrical properties of elastic epoxy. Permittivity and Tan$\delta$ depend on elastomer composition. Namely, permittivity and Tan$\delta$ increase according to the elastomer contents. For experimental analysis results, 20phr was considered an excellent specimen.

키워드

References

  1. S.C. Kim, 'Polymer Engineering I', HEE JOONG DANG, 1994. Chapter 1-14
  2. T.S. Yoon, B.S. Kim, J.H. Kim, D.S. Lee, 'Cure Behavior of high Performance Epoxy/ Polysulfone Blends (I): Isothermal DSC Analysis', Polymer (Korea), Vol.20, pp.403-411, 1996
  3. T.S. McQuarie, 'corrosion Resistant Properties of Polymer Insulator Core Roads', Synpos. Nonceramic Insulator Technology, Singapore, 1996
  4. B. Noble, S. Harris and M. Owen, 'Stress Corrosion Cracking of GRP pultruded Rods in Acid Environments', J. Materials Sci., Vol.18, pp.1244-1254, 1983
  5. A.G. Mctcalfe and G.K. Schmitz, 'Mechanism of Stress Corrosion in E-Glass Fillaments', Glass Technology, Vol.13, pp.5-16, 1972
  6. S.C. Santucci, S. Corezzi, D. Fioretto, S. Capaccioli, R. Casalini, M. Lucchesi, S. Presto, and P.A. Rolla, 'Glass transition of an epoxy resin. A wideband dielectric investigation', IEEE Transactions on DEI, Vol. 8, No.3, June 2001
  7. R. Moser, K. Robert, K. Thomas, 'Single component epoxy systems used for enhanced electrical performance and applications', Proc. Electrical InsulationConference and Electrical manufacturing & Coil Winding Conference, pp.379-385, Oct. 1993
  8. J.H. Ko, A. Hushur, D.H. Kim, S. Kojima, J.P. Kim, M.S. Jang, Bryan C, 'Elastic Properties of Bismuth Layer-Structure Perovskite Single Crystals Studied by Brillouin Scattering', Journal of the Korean Physical Society, Vo.142, No.94, pp.S1084-S1087, 2003
  9. K.S. J, D.H. Chun, D.G. Lee, 'A Study on the Mechanical and Thermo-mechanical of Epoxy Resin Systems', Journal of the Korean Society for Materials, Vol.10, No.4, pp.1-10, 1997
  10. S.J. Park, F.L. Jin, J.R. Lee, J.S. Shin, 'hermal Properties and Fracture Toughness Bisphenol-Based DGEBA/DGEBS Epoxy Blend System' Polymer (Korea), No.1, pp.33-39, 2003
  11. K. B Lim, B. S Lee, M. Y Chung, D. C Lee,' Analyses on the Increment of Surface Hydrophobicity of Epoxy Composites by Thermal Treatment', Kiee, Vol. 50C, No. 4, April. 2001
  12. J. Montesinos, R.S. Gorur, B. Mobasher, D. Kingsbury, 'Mechanism of brittle fracture in nonceramic insulators', IEEE Transactions on DEI, Vol. 9, No.2, April 2002
  13. J. N. Price and D. Hull, 'Effect of Matrix Toughness on Crack Propagation during Stress Corrosion of Glass Reinforced Composites', Composites Science and Technology, Vol.28, pp.193-210, 1987
  14. S.O. Kasap, 'Principles of Electronic Materials and Devices', McGraw-Hill, 2002, Chapter 2 and 7
  15. Y. Li and J. Unsworth, 'Effect of physical aging on dielectric, thermal and mechanical properties of castepoxy insulators', IEEE Transactions on DEI, Vol. 1, No.1, Feb. 1994
  16. H. D Kim, 'Electrical and Chemical Properties of Mica/Epoxy Composite Materials as Affected by Short-Time Aging', KIEE Inter. Trans. on EA, Vol.3, No.2, pp.59-65, 2003