KIEE International Transactions on Electrophysics and Applications

The Korean Institute of Electrical Engineers (대한전기학회)
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Improved Thermal, Structural and Electrical Properties of Elastic-Epoxy Blends System

  • Lee, Kyoung-Yong (School of Electrical, Electronics and Information Engineering, Wonkwang University) ;
  • Lee, Kwan-Woo (School of Electrical, Electronics and Information Engineering, Wonkwang University) ;
  • Choi, Yong-Sung (School of Electrical, Electronics and Information Engineering, Wonkwang University) ;
  • Park, Dae-Hee (School of Electrical, Electronics and Information Engineering, Wonkwang University)
  • Published : 2004.10.01
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Abstract

In this paper, epoxy elasticity factors were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microscope) to improve toughness and reduce brittleness of existing epoxy resin. Dumbbell shaped specimens were made and tested at rates of 0, 20 and 35phr (part per hundred resins). TMA temperatures ranged from -2$0^{\circ}C$ to 20$0^{\circ}C$. Tg (glass transition temperature) of elastic epoxy was measured by thermal analysis. Also investigated were thermal expansion coefficient ($\alpha$), modulus and Tan$\delta$ (loss factor). And we analyzed structure through FESEM, could find elastic-factors of elastic epoxy that is not existing-epoxy. In addition, we measured permittivity and Tan$\delta$ for investigation of the electrical properties of elastic epoxy. Permittivity and Tan$\delta$ depend on elastomer composition. Namely, permittivity and Tan$\delta$ increase according to the elastomer contents. For experimental analysis results, 20phr was considered an excellent specimen.

Keywords

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