Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer

  • Yang, Ji-Hyuck (Hyundai Motor Company) ;
  • Lee, Kang-Yong (School of Mechanical Engineering, Yonsei University) ;
  • Dong, C. Y. (School of Mechanical Engineering, Yonsei University)
  • 발행 : 2004.09.01

초록

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

키워드

참고문헌

  1. ABAQUS User's Manual, Ver. 6.0, HKS Inc.
  2. Aihara, T., Ito, S., Sasajima, H. and Oota, K., 2001, 'Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials,' ASME Trans. J. of Electronic Packaging, Vol. 123, pp. 88-94 https://doi.org/10.1115/1.1329129
  3. Ahn, S. H. and Kwon, Y. S., 1995, 'Popcorn Phenomena in a Ball Grid Array Package,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 18, pp.491-495 https://doi.org/10.1109/96.404107
  4. Egan, E., Kelly, G. and Herard, L., 1999, 'PBGA Warpage and Stress Prediction for Efficient Creation of the Thermomechanical Design Space for Package-Level Reliability,' Proc. 49th Electronic Components and Technology Conference, ECTC 99, San Diego, pp. 1217-1223 https://doi.org/10.1109/ECTC.1999.776384
  5. Gunasekera, J. S. and Ali, A. F., 1995, 'A Three-Step Approach to Designing a Metal-Forming Process,' JOM, Vol. 47, pp.22-25
  6. Hong, B. Z. and Su, L. S., 1998, 'Popcorning in PBGA Packages During IR Reflow Soldering,' Proc. 48th Electronic Components and Technology Conference, ECTC 98, Seattle, pp. 503-510
  7. Hwang, J. S., 1994, 'Reliability of BGA Solder Interconnections,' Electron. Eng. Times, pp. 81-85
  8. Jung, W., Lau, J. H. and Pao, Y. H., 1997, 'Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints,' ASME Trans. J. of Electronic Packaging, Vol. 119, pp.163-170
  9. Kelly, G., 1999, 'The Simulation of Thermomechanical Induced Stress in Plastic Encapsulated IC Packages,' Dordrecht, The Netherlands, Kluwer
  10. Lee, K. Y. and Yang, J. H., 1999, 'Hygrothermal Cracking Analysis of Plastic IC Package with Po1yimide Coating Layer,' Transactions of KSME A, Vol. 23, No.9, pp. 1491-1498
  11. Mawer, A., Darveaux, R. and Petrucci, A. M., 1993, 'Calculation of Thermal Cycling and Application Fatigue Life of the Plastic Ball Grid Array (BGA) Package,' Proc. Int. Electron. Pkg. Conf., pp. 718-730
  12. McCluskey, P., Munamarty, R. and Pecht, M., 1996, 'Popcorning in PBGA Packages During IR Reflow Soldering,' Proc. International Electronics Packaging Conference, Edina, pp.271-281
  13. Mertol, A., 1995, 'Application of the Taguchi Method on the Robust Design of Molded 225 Plastic Ball Grid Array Packages,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 18, pp. 734-743 https://doi.org/10.1109/96.475283
  14. Mertol, A., 1997, 'Optimization of High Pin Count Cavity-Up Enhanced Plastic Ball Grid Array (EPBGA) Packages for Robust Design,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 20, pp.376-388 https://doi.org/10.1109/96.641505
  15. Moore, T. D. and Jarvis, J. L., 2001, 'Failure Analysis and Stress Simulation in Small Multichip BGAs,' IEEE Trans. Advanced Packaging, Vol. 24, pp.216-223 https://doi.org/10.1109/6040.928757
  16. Moore, T. D. and Jarvis, J. L., 2001, 'Improved Reliability in Small Multichip Ball Grid Arrays,' Microelectronics Reliability, Vol. 41, pp.461-469 https://doi.org/10.1016/S0026-2714(00)00230-4
  17. Omi, S., Fujita, K., Tsuda, T. and Meade, T., 1991, 'Causes of Cracks in SMD and Type-Specific Remedies,' Proc. Electronic Components Conf., pp. 766-771 https://doi.org/10.1109/ECTC.1991.163966
  18. Pecht, M. G., 1999, 'Moisture Sensitivity Characterization of Build-Up Ball Grid Array Substrates,' IEEE Trans. on Advanced Packaging, Vol. 22, pp. 515-523 https://doi.org/10.1109/6040.784506
  19. Rajan, S. D., Nagaraj, B. and Mahalingam, M., 1992, 'A Shape Optimal Design Methodology for Packaging Design,' ASME Trans. J. of Electronic Packaging, Vol. 114, pp. 461-466
  20. Romer, B. and Pape, H., 1989, 'Stress Effects of Package Parameters on 4MEGA DRAM with Fractional Factorial Designed Finite Element Analysis,' Proc. Electronic Components Conf., pp. 832-839 https://doi.org/10.1109/ECC.1989.77842
  21. Shin, M. K., Hong, S. W. and Park, G. J., 2001, 'Axiomatic Design of the Motor-Driven Tilt/Telescopic Steering System for Safety and Vibration,' Proc. Instn. Mech. Engrs. Part D., Vol. 215, pp. 179-187 https://doi.org/10.1243/0954407011525566
  22. Suh, N. P., 1990, 'The Principles of Design,' Oxford University Press, New York
  23. Takeuchi, E., Takeda, T. and Hirano, T., 1990, 'Effect of Combination Between Various Polyimide Coating Materials and Molding Compounds on the Reliability of Integrated Circuits (ICs),' Proc. Electronic Components Conf., pp.818-823 https://doi.org/10.1109/ECTC.1990.122284
  24. Yang, J. H., Lee, K. Y., Lee, T. S. and Zhao, S. X., 2004, 'Fracture Analysis of Electronic IC Package,' KSME International Journal, Vol. 18, No.3, pp. 357-369