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Evaluation of the Residual Stress with Respect to Supporting Type of Multi-layer Thin Film for the Metallization of Pressure Sensor

압력센서의 배선을 위한 다층 박막의 지지조건 변화에 따른 잔류응력 평가

  • 심재준 (동아대학교 일반대학원 기계공학과) ;
  • 한동섭 (동아대학교 일반대학원 기계공학과) ;
  • 한근조 (동아대학교 기계공학과)
  • Published : 2004.05.01

Abstract

MEMS technology applying to the sensors and micro-electro devices is complete system. These microsystems are made by variable processes. Especially, the mentallization process has very important functions to transfer the power operating the sensor and signal induced from sensor part. But in the structures of MEMS the local stress concentration and deformation are often yielded by an irregular geometrical shape and different constraint. Therefore, this paper studies the effect of supporting type and thickness ratio about thin film of the substrate on the residual stress variation when the thermal loads is applied to the multi-layer thin film fabricated by metallization process. Specimens were made from several materials such as Al, Au and Cu. Then, uniform thermal load was applied, repeatedly. The residual stress was measured by FE Analysis and nano-indentation method using AFM. Generally, the specimen made of Al induced the larger residual stress than that of made of other materials. Specimen made of Cu and Au having the low thermal expansion coefficient induces the minimum residual stress. Similarly, the lowest indentation length was measured by nano-indentation method in the Si/Au/Cu specimen. Particularly, clusters are created in the specimen made of Cu by thermal load and the indentation length became increasingly large by cluster formation.

Keywords

References

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Cited by

  1. An integrated sensor for pressure, temperature, and relative humidity based on MEMS technology vol.20, pp.4, 2006, https://doi.org/10.1007/BF02916481