Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
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Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process

미세 비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성

  • 신승용 (서울대학교 대학원) ;
  • 임성한 (서울대학교 정밀기계설계공동연구소) ;
  • 주병윤 (서울대학교 대학원) ;
  • 오수익 (서울대학교 기계항공공학부)
  • Published : 2004.02.01
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Abstract

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

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References

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