Temperature Measurement of Silicon Wafers Using Phase Estimation of Acoustic Wave

음향파의 위상 추정을 이용한 실리콘 웨이퍼의 온도 측정

  • Published : 2003.11.01

Abstract

Accurate temperature measurement is a key factor to implement the rapid thermal processing(RTP). A temperature estimation method using acoustic wave has been proposed to overcome the inaccuracy and contamination problem of the previous methods. The proposed method, however, may suffer from the offset and low resolution problem since it is implemented in the time domain. This paper presents a temperature estimation method using the phase detection of acoustic wave. Based on the frequency domain approach, the proposed technique increases the resolution of the measured temperature and reduces the effect of noise. We investigate the performance of the proposed method via experiments.

Keywords

References

  1. Y. J. Lee, B. T. Khuri-Yakub and K.Saraswat, 'Temperature measurement in rapid thermal processing using the acoustic temperature sensor,' IEEE Trans. on Semiconductor Manufacturing, vol.9, no.1, pp.115-121, Feb.1996 https://doi.org/10.1109/66.484291
  2. J. Yan, A New Approach to Measure the Temperature in Rapid Thermal Processing(RTP), PhD thesis, The University of Texas at Austin, May 1999
  3. Y. M. Cho, P. Dankoski, Y. C. Pati, G. Xu and T. Kailath, 'Temperature profile estimation of a semiconductor wafer using acoustic tomography,' Proc. Asilomar'93, 1993