Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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A New CMOS RF Model for RF IC Design

RF IC 설계를 위한 새로운 CMOS RF 모델

  • 박광민 (순천향대학교 정보기술공학부)
  • Published : 2003.08.01
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Abstract

In this paper, a new CMOS RF model for RF IC design including the capacitance effect, the skin effect, and the proximity effect between metal lines on the Si surface is proposed for tile first time for accurately predicting the RF behavior of CMOS devices. The capacitances between metal lines on the Si surface are modeled with the layout. And the skin effect is modeled with a parallel branch added in equivalent circuit of metal line. The proximity effect is modeled by adding the mutual inductance between cross-coupled inductances in the ladder circuit representation. Compared to the BSIM 3v3. the proposed RF model shows good agreements with the measured data and shows well the frequency dependent behavior of devices in GHz ranges.

본 논문에서는 CMOS 소자의 RF 동작을 정확히 예측하기 위해 Si 표면에서의 메탈 라인 사이의 커패시턴스 효과와 표피효과 및 근접효과를 포함한 RF IC 설계를 위한 새로운 CMOS RF 모델을 처음으로 제시하였다. Si 표면에서의 메탈 라인 사이의 커패시턴스는 레이아웃에 기초하여 모델링하였으며, 표피효과는 메탈 라인의 등가회로에 병렬회로를 부가하여 사다리꼴 등가회로로 구현하였다. 근접효과는 사다리꼴 등가회로에서 교차 결합된 인덕턴스 사이의 상호 인덕턴스를 부가함으로써 모델링하였다. 제안된 RF 모델은 BSIM 3v3에 비해 측정 데이터와 잘 일치하였으며, GHz 영역에서 소자 동작의 주파수 종속성을 잘 보여주었다.

Keywords

References

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