참고문헌
- Polym. Eng. Sci. v.13 J.Meyer https://doi.org/10.1002/pen.760130611
- Comp. Sci. Tech. v.61 X.S.Yi;L.Shen;Y.Pan https://doi.org/10.1016/S0266-3538(00)00191-3
- Polymer v.41 J.Feng;C.M.Chan https://doi.org/10.1016/S0032-3861(00)00095-1
- Polym. Comp. v.19 Z.Z.Huang;R.Yue;H.L.W.Chan;C.L.Choy https://doi.org/10.1002/pc.10152
- J. Appl. Polym. Sci. v.81 H.Mironi;M.Narkis https://doi.org/10.1002/app.1419
- J. Appl. Polym. Sci. v.19 C.Klason;J.Kubat https://doi.org/10.1002/app.1975.070190319
- J. Euro. Ceram. Soc. v.15 J.D.Russell;C.Leach https://doi.org/10.1016/0955-2219(95)00023-N
- J. Appl. Phys. v.60 B.Lundberg;B.Sundqvist https://doi.org/10.1063/1.337401
- Macromol. Symp. v.170 Y.Mamunya https://doi.org/10.1002/1521-3900(200106)170:1<257::AID-MASY257>3.0.CO;2-J
- Carbon v.39 M.Hindermann Bischoff;F.Ehrburger Dollle https://doi.org/10.1016/S0008-6223(00)00130-5
- J. Polym. Sci., Part B: Polym. Phys. v.39 H.Mironi;M.Narkis https://doi.org/10.1002/polb.1113
- Eur. Polym. J. v.33 H.Tang;X.G.Chen;Y.X.Luo https://doi.org/10.1016/S0014-3057(96)00221-2
- J. Appl. Polym. Sci. v.66 W.T.Jia;X.F.Chen https://doi.org/10.1002/(SICI)1097-4628(19971205)66:10<1885::AID-APP5>3.0.CO;2-J
- J. Mater. Sci. v.35 H.M.A.Allak;A.W.Brinkman;J.Woods
- IEMT/IMC Proceeding A.H.Feingold;P.Amstutz;R.L.Wahlers;C.Huang; S.J.Stein
- J. Appl. Polym. Sci. v.83 J.F.Zhang;Q.Zheng;Y.Q.Yang;X.S.Yi https://doi.org/10.1002/app.10049
- Microelectronics Reliablity v.41 O.Mrooz;A.Kovalski;J.Pogorzelska;O.Shpotyuk;M.Vakiv;B.Butkiewicz;J.Maciak https://doi.org/10.1016/S0026-2714(01)00027-0
- Carbon v.40 Y.Bin;C.Xu;D.Zhu;M.Matsuo https://doi.org/10.1016/S0008-6223(01)00173-7
- J. Appl. Polym. Sci. v.67 X.S.Yi;G.Wu;D.Ma https://doi.org/10.1002/(SICI)1097-4628(19980103)67:1<131::AID-APP15>3.0.CO;2-4
- J. Appl. Polym. Sci. v.77 X.S.Yi;J.F.Zhang;Q.Zheng;Y.Pan https://doi.org/10.1002/(SICI)1097-4628(20000718)77:3<494::AID-APP4>3.0.CO;2-K
- Carbon v.39 A.Subrenat;J.N.Baleo;P.L.Cloirec;P.E.Blanc https://doi.org/10.1016/S0008-6223(00)00177-9
- Transaction on Power Delivery v.14 R.Strumpler;J.skindhøj;J,G.Reichenbach;J.H.W.Kuhlefelt;F.Perdoncin https://doi.org/10.1109/61.754084
- J. Euro. Ceram. Soc. v.20 P.Supancic https://doi.org/10.1016/S0955-2219(00)00100-X
- Sensor Actuat. B-Chem. v.60 S.Chatterjee;K.Sengupta;H.S.Maiti https://doi.org/10.1016/S0925-4005(99)00265-8
- J. Appl. Phys. v.81 R.Strumpler;G.Maidorn;J.Rhyner https://doi.org/10.1063/1.365222
- Mater. Chem. Phys. v.67 S.Chatterjee;H.S.Maiti https://doi.org/10.1016/S0254-0584(00)00454-5
- Transactions on Compoments Hybrids and Manufacturing Technology v.CHMT-4 F.A.Doljack
- Korea patent 10-2001-0027981 S.J.Lee;J.D.Nam;S.J.Suh;J.W.Yoon
- Korea Patent 20-2001-0011056 S.J.Lee;J.D.Nam;S.J.Suh
- International Symposium of Carbon v.C10-07 K.Hongawa;T.Kawai;A.Yokoyama
- J. Polym. Sci., Part B:Polym. Phys. v.38 Y. Song;Y.Pan;Q.Zheng;X.S.Yi https://doi.org/10.1002/1099-0488(20000701)38:13<1756::AID-POLB90>3.0.CO;2-P
- J. Clin. Apher. v.14 H.Toshihiko;S.Kimihiro;O.Makoto;T.M.Mitsuyo;K.Makoto;H.Takuya;M.Yuji;K.Makoto;O.Fumitaka https://doi.org/10.1002/(SICI)1098-1101(1999)14:2<63::AID-JCA3>3.0.CO;2-B
- Electronics and Communications in Japan, Part 2 v.82 A.Ueno;S.Sugawa
- Mater. Sci. Eng. B v.38 H.R.Kokabi;M.Rapeauz;J.A.Aymami;G.Desgardin https://doi.org/10.1016/0921-5107(95)01504-3
- Transaction on Electrical Insulating v.EI-20 R.D.Ford;I.M.Vitkovitsky https://doi.org/10.1109/TEI.1985.348753
- Transactions on Components, Packaging and Manufacturing Technology-Part A v.18 L.Wang;Z.Zhou https://doi.org/10.1109/95.390297
- Synthetic Metals v.101 Y.W.Liu;K.Oshima;T.Yamauchi;M.Shimomura;S.Miyauchi https://doi.org/10.1016/S0379-6779(98)01172-2
- J. Appl. Polym. Sci. v.73 G.Yu;M.Q.Zhang;H.M.Zeng;Y.H.Hou;H.B.Zhang https://doi.org/10.1002/(SICI)1097-4628(19990725)73:4<489::AID-APP4>3.0.CO;2-A
- Transactions on Components and Packaging Technologies v.23 S.Luo;C.P.Wong https://doi.org/10.1109/6144.833054
- Polymer v.41 J.Feng;C.M.Chan https://doi.org/10.1016/S0032-3861(99)00690-4
- J. Appl. Polym. Sci. v.73 G.Yu;M.Q.Zhang;H.M.Zeng;Y.H.Hou;H.B.Zhang https://doi.org/10.1002/(SICI)1097-4628(19990725)73:4<489::AID-APP4>3.0.CO;2-A
- J. Appl. Polym. Sci. v.77 X.Zhang;Y.Pan;L.Shen;X.Yi https://doi.org/10.1002/(SICI)1097-4628(20000725)77:4<756::AID-APP7>3.0.CO;2-Y
- J. Appl. Polym. sci. v.80 X.He;L.Wang,X.Chen https://doi.org/10.1002/app.1249
- J. Appl. Polym. Sci. v.66 W.Jia;X.Chen https://doi.org/10.1002/(SICI)1097-4628(19971205)66:10<1885::AID-APP5>3.0.CO;2-J
- J. Appl. Polym. Sci. v.73 O.Breuer;R.Tchoudakov;M.Nakkis;A.Siegmann
- Polymer(Korea) v.26 J.C.Kim;G.H.Park;S.J.Suh;Y.K.Lee;S.J.Lee;S.J.Lee;J.D.Nam
- J. Appl. Polym. Sci. v.77 Y.Liu;K.Oshima;T.Yamauchi;M.Shimomura;S.Miyauchi https://doi.org/10.1002/1097-4628(20000929)77:14<3069::AID-APP70>3.0.CO;2-B
- J. Appl. Polym. Sci. v.80 G.Wu;C.Zhang;T.Miura;S.Asai;M.Sumita https://doi.org/10.1002/app.1191
- Synthetic Metals v.102 G.Boiteux;J.Fournier;D.Issotier;G.Seytre;G.Marichy https://doi.org/10.1016/S0379-6779(98)01432-5
- J. Appl, Phys. v.53 K.T.Chung;A.Sabo;A.P.Pica https://doi.org/10.1063/1.330027
- Prog. Polym. Sci. v.24 G.Moad https://doi.org/10.1016/S0079-6700(98)00017-3
- J. Appl. Polym. Sci. v.49 T.Bremner;A.Rudin https://doi.org/10.1002/app.1993.070490504
- Carbon v.32 H.P.Boehm https://doi.org/10.1016/0008-6223(94)90031-0
- Polymer v.43 L.Yang;F.Zhang;T.Endo;T.Hirotsu https://doi.org/10.1016/S0032-3861(01)00802-3
- Polym. Int. v.59 D.Roy;G.P.Simon;M.Forsyth
- Polym. Adv. Technol. v.32 J.K.Mishra;S.Roychowdhury;C.K.Das