참고문헌
- R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein, Microelectronics Packaging Handbook, 2nd ed. New York: Chapman & Hall, 1997,pt. I
- J. Svedin, 'A numerically efficient finite-element formulation for the general waveguide problem without spurius modes,' IEEE Trans. Microwave Theory & Tech., vol.37, pp.302-307, 1966
- T. Watanabe and H. Asai, 'Synthesis of time-domain models for interconnects having 3-D structures based on FDTD method,' IEEE Trans. Circuits & Syst.-II, vol.47, no.4, p.302, April 2000 https://doi.org/10.1109/82.839665
- A.E. Ruehli, 'Equivalent circuit models for three-dimensional multiconductor system,' IEEE Trans. Microwave Theory & Tech, vol.22, no.3, March 1974
- K. Lee and A. Barber, 'Modeling and analysis of multichip module power supply planes,' IEEE Trans. COMT-Part B, vol.18, no.4, pp,628-639, Nov. 1995 https://doi.org/10.1109/96.475268
- H.B. Bakoglu, Circuit, Interconnections, and Packaging for VLSI, Addison Wesley Pub. Co., Inc., 1990
- L.M. Silverira, M. Kamon, I. Elfadel, and J. White, 'A Coordinate-Transformed Arnoldi Algorithm for Generating Guarantee Stable Reduced-Order Models of RLC Circuits,' Proc. IEEE/ACM International conf. On Computer-Aided Design, pp. 288-294, 1996 https://doi.org/10.1109/ICCAD.1996.569710
- 김석윤, VLSI 시스템 회로연결선의 모형화 및 해석, IDEC 교재 개발 시리즈 10, 시그마프레스, 1999
- 백종흠, 김석윤, 'VLSI 회로연결선의 효율적 해석을 위한 거시 모형,' 1995년 5월, 전자공학회논문지, 36권, C편, p12-26
- A. KAMO, T. WATANABE, and H. ASAI, 'A New Methodology for Optimal Placement of Decoupling Capacitors on Printed Circuit Board,' IEICE TTRAN. FUNDAMENTALS, VOL.E84-A, NO.12 DECEMBER 2001
- J. Douglas Faires, Richard L. Burden, Numerical Methods, PWS Publishing Company, 1993
- A. Odabasioglu, M. Celik, 'PRIMA: Passive Reduced-order Interconnect Macromodeling Algorithm,' IEEE Tran. on Computer-Aided Design of Intergrated Circuits and Systems, vol.17, No.8, August 1998 https://doi.org/10.1109/43.712097
- J. H. Kim and M. Swaminathan, 'Modeling of Irregular Shaped Power Distribution Planes Using Transmission Matrix Method,' IEEE. Tran. on Advanced Packaging, vol.24, No.3, August 2001 https://doi.org/10.1109/6040.938301