DC and RF Characteristics of $Si_{0.8}Ge_{0.2}$ pMOSFETs: Enhanced Operation Speed and Low 1/f Noise

  • Song, Young-Joo (Wireless Communication Device Research Department, ETRI) ;
  • Shim, Kyu-Hwan (Wireless Communication Device Research Department, ETRI) ;
  • Kang, Jin-Young (Wireless Communication Device Research Department, ETRI) ;
  • Cho, Kyoung-Ik (Wireless Communication Device Research Department, ETRI)
  • Received : 2002.11.07
  • Published : 2003.06.30

Abstract

This paper reports on our investigation of DC and RF characteristics of p-channel metal oxide semiconductor field effect transistors (pMOSFETs) with a compressively strained $Si_{0.8}Ge_{0.2}$ channel. Because of enhanced hole mobility in the $Si_{0.8}Ge_{0.2}$ buried layer, the $Si_{0.8}Ge_{0.2}$ pMOSFET showed improved DC and RF characteristics. We demonstrate that the 1/f noise in the $Si_{0.8}Ge_{0.2}$ pMOSFET was much lower than that in the all-Si counterpart, regardless of gate-oxide degradation by electrical stress. These results suggest that the $Si_{0.8}Ge_{0.2}$ pMOSFET is suitable for RF applications that require high speed and low 1/f noise.

Keywords

References

  1. IEEE Trans. Electron Devices v.48 RF-CMOS Performance Trends Woerlee, P.H.;Knitel, M.J.;van Langevelde, R.;Klaassen, D.B.M.;Tiemeijer, L.F.;Scholten, A.J.;Zegers-van Duijnhoven, A.T.A.
  2. Thin Solid Films v.369 Strained Si1-xGex Graded Channel PMOSFET Grown by UHVCVD Su, C.Y.;Wu, S.L.;Chang, S.J.;Chen, L.P.
  3. Appl. Phys. Lett. v.78 Effective Mobilities in Pseudomorphic Si/SiGe/Si p-Channel Metal-Oxide-Semiconductor Field-Effect-Transistors with Thin Silicon Capping Layers Palmer, M.J.;Braithwaite, G.;Grasby, T.J.;Phillips, P.J.;Prest, M.J.;Parker, E.H.C.;Whall, T.E.;Parry, C.P.;Waite, A.M.;Evans, A.G.R.;Roy, S.;Watling, J.R.;Kaya, S.;Asenov, A.
  4. Solid-State Electronics v.46 On the Origin of the LF Noise in Si/Ge MOSFETs Ghibaudo, G.;Chroboczek, J.
  5. IEEE Trans. Electron Devices v.46 DC and Low-Frequency Noise Characteristics of SiGe p-Channel FET’s Designed for $0.13-{\mu}m$ Technology Okhonin, S.;Py, M.A.;Georgescu, B.;Fischer, H.;Risch, L.
  6. ETRI J. v.23 no.4 Phase Noise Reduction of Microwave HEMT Oscillators Using a Dielectric Resonator Coupled by a High Impedance Inverter Lee, Moon-Que;Ryu, Keun-Kwan;Yom, In-Bok
  7. Solid-State Electronics v.43 On the Flicker Noise in Submicron Silicon MOSFETs Simoen, E.;Claeys, C.
  8. ETRI J. v.21 no.4 Thick Metal CMOS Technology on High Resistivity Substrate and its Application to Monolithic L-Band CMOS LNAs Kim, C.S.;Park, M.;Kim, C.H.;Yu, H.K.;Cho, H.J.
  9. Solid-State Electronics v.44 Simulation and Optimization of Strained $Si_{1-x}Ge_x$ Buried Channel p-MOSFETs Shi, Z;Chen, X;Onsongo, D.;Quinones, E.J.;Banerjee, S.K.
  10. Solid-State Electronics v.46 Analysis of Si/SiGe Channel pMOSFETs for Deep-Submicron Scaling Li, P.W.;Liao, W.M.
  11. IEEE Trans. Electron Devices v.43 Theory and Observation of Enhanced High Field Hole Transport in $Si_{1-x}Ge_x$ Quantum Well p-MOSFET’s Bhaumik, K.;Shacham-Diamond, Y.;Noel, J.P.;Bevk, J.;Feldman, L.C.
  12. IEDM Tech. Dig. Hole Confinement and its Impact on Low-Frequency Noise in SiGe pFET’s on Sapphire Mathew, S.J.;Niu, G.;Dubbelday, W.B.;Cressler, J.D.;Ott, J.A.;Chu, J.O.;Mooney, P.M.;Kavanagh, K.L.;Meyerson, B.S.;Lagnado, I.
  13. Proc. ESSDERC'2001 $Si/Si_{0.64}Ge_{0.36}/Si$ pMOSFETs with Enhanced Voltage Gain and Low 1/f noise Prest, M.J.;Palmer, M.J.;Braithwaite, G.;Grasby, T.J.;Philips, P.J.;Mironov, O.A.;Parker, E.H.C.;Whall, T.E.;Waite, A.M.;Evans, A.G.R.
  14. IEEE Trans. Electron Devices v.46 Low Frequency Noise Measurements of p-Channel $SI_{1-x}GE_x$ MOSFETs Lambert, A.D.;Alderman, B;Lander, R.J.O.;Parker, E.H.C.;Whall, T.E.