Transactions of the Korean hydrogen and new energy society (한국수소및신에너지학회논문집)

The Korean Hydrogen and New Energy Society (한국수소및신에너지학회)
권호 표지

Effect of Heat Treatment of Mg2Ni Thin Film Electrode on the Electrochemical Properties

Mg2Ni 박막 전극의 전기화학적 특성에 미치는 열처리의 효과

  • Lim, Young-Taek (Department of Metallurgical & Materials Engineering, Gyeongsang National University, Advanced Materials Research Institute) ;
  • Ryu, Dong-Hyun (Department of Metallurgical & Materials Engineering, Gyeongsang National University, Advanced Materials Research Institute) ;
  • Kim, Ki-Won (Department of Metallurgical & Materials Engineering, Gyeongsang National University, Advanced Materials Research Institute) ;
  • Hur, Bo-Young (Department of Metallurgical & Materials Engineering, Gyeongsang National University, Advanced Materials Research Institute) ;
  • Ahn, Hyo-Jun (Department of Metallurgical & Materials Engineering, Gyeongsang National University, Advanced Materials Research Institute)
  • 임영택 (경상대학교 재료공학부, 첨단소재연구센터) ;
  • 류동현 (경상대학교 재료공학부, 첨단소재연구센터) ;
  • 김기원 (경상대학교 재료공학부, 첨단소재연구센터) ;
  • 허보영 (경상대학교 재료공학부, 첨단소재연구센터) ;
  • 안효준 (경상대학교 재료공학부, 첨단소재연구센터)
  • Published : 2002.09.15
Download PDF
⟨ Previous Next ⟩

Abstract

Ni/MH 박막전지의 전극으로 사용될 수 $Mg_{2}Ni$박막을 스퍼터링방법으로 제조하였다. $Mg_{2}Ni$합금박막은 Mg, Ni타?을 이용하여 동시에 스퍼터링함으로서 제조하였다. KOH 액체전해질 및 $Ni(OH)_2$전극을 이용하여 전기화학실험을 하였다. $Mg_2Ni$ 박막의 초기 싸이클 특성에 미치는 열처리 효과를 조사하기 위하여, $200-550^{\circ}C$로 변화시키면서 진공중에서 열처리를 하였다. 열처리온도가 $300^{\circ}C$ 이하에서는 초기방전용량이 증가하였으며, $400^{\circ}C$ 열처리시에는 활성화시의 방전용량이 약 160mAh/g으로 가장 크게 나타났다.

Keywords

Acknowledgement

Supported by : Korea Energy management Corporation

References

  1. F. E. Lynch, J. Less-Common Metals, Vol.174, 1991, pp. 943 https://doi.org/10.1016/S0022-5088(06)80001-9
  2. M. Geng, J. Han, F. Feng, and D. O.Northwood, Int. J. Hydrogen Energy, Vol.23, 1998, pp. 1055 https://doi.org/10.1016/S0360-3199(98)00020-2
  3. G. Paul, A. John, C. Dennis, and V. Srinivasan, J. Power Sources, Vol.80, 1999,pp. 157 https://doi.org/10.1016/S0378-7753(99)00070-1
  4. J. B. Bates, N. J. Dudney, B. Neudecker, A. Ueda, and C. D. Evans, Solid State lonics, Vol.135, 2000, pp. 33 https://doi.org/10.1016/S0167-2738(00)00327-1
  5. S.J. Lee, H.Y. Lee, S.H. Jeong, H.K. Baik, S.M. Lee, J. Power Sources Vol.lll, 2002, pp. 345
  6. Y. Ratieuville, B. L. Wu, D. Lincot, J. Vedel and L. T. Yu, J. Electrochem. Soc, Vol.146, 1999, pp. 3161 https://doi.org/10.1149/1.1392449
  7. N. J. Dudney and B. J. Neudecker, Current Opinion in Solid State and Materials Science Vol.4, 1999, pp. 479 https://doi.org/10.1016/S1359-0286(99)00052-2
  8. C. Branci, N. Benjelloun, J. San-adin, and M. Ribes, Solid State lonics Vol.135, 2000, pp.169 https://doi.org/10.1016/S0167-2738(00)00297-6
  9. D.S. Kim, M. K. Kim, J.T.Son and H.G.Kim, J. Power Sources, Vol.108, 2002, pp.239 https://doi.org/10.1016/S0378-7753(02)00025-3
  10. T. Sakai, H. Ishikawa, H. Miyamurea and T. Iwasaki, J. Electrochem. Soc., Vol.138, 1991, pp. 908 https://doi.org/10.1149/1.2085746
  11. N. Kuriyama, T. Sakai and H. Ishikawa, J. Solid State lonics, Vol.56, 1992, pp. 688 https://doi.org/10.1016/0167-2738(92)90448-X
  12. L.Yang, Habib, and M. Ahsan, J. Alloys and Compounds, Vol.209, 1994, pp. 7 https://doi.org/10.1016/0925-8388(94)91070-7
  13. T.Kohno, S.Tsuruta, and M. Kanda, J.Electrochem. Soc., Vol.143, 1996, pp. 198 https://doi.org/10.1149/1.1837089
  14. J. Chen, P. Yao, D. H. Bradhurst, S. X.Dou and H. K. Liu, J. Alloys Comp.,Vol.293.295, 1999, pp. 675
  15. S. C. Han, P. S. Lee, J. Y. Lee, A. Zuttel and L. Schlapbach, J. Alloys Comp.,Vol.306, 2000, pp. 219 https://doi.org/10.1016/S0925-8388(00)00753-2
  16. J. J. Jiang and M.Gasik, J. Power Sources, Vol.89, 2000, pp. 117 https://doi.org/10.1016/S0378-7753(00)00400-6
  17. N. Cui, J. L. Luo and K. T. Chuang, J.Alloys Comp., Vol.302, 2000, pp. 218 https://doi.org/10.1016/S0925-8388(99)00671-4
  18. T. Spassov and U. Koster, Journal of Alloys and Compounds, Vol.279, 1998, pp.279 https://doi.org/10.1016/S0925-8388(98)00680-X
  19. M. Suzuki, T. Tanaka and K. Kawabata, Thin Solid Films, Vol.343, 1999, pp. 21 https://doi.org/10.1016/S0040-6090(98)01562-4
  20. S.S. Lee, K.W. Kim, B.Y. Hur, T.H. Nam, and H.J.Ahn, Metals and Materials Vol.7, 2001, pp. 265 https://doi.org/10.1007/BF03026985
  21. T. Kohno, M. Yamamoto and M. Kanda, J. Alloys Comp., Vol.293-295, 1999, pp. 643
  22. N. H. Goo, J. H. Woo, and K. S. Lee, J.Alloys Comp., Vol.288, 1999, pp. 286 https://doi.org/10.1016/S0925-8388(99)00100-0
  23. T. Kohno and M. Kanda, J. Electrochem.Soc., Vol.144, 1997, pp. 2384 https://doi.org/10.1149/1.1837823