참고문헌
- Darveaux, R. and Mawer, A., 1995, 'Thermal and Power Cycle Limit of Plastic ball grid array (PBGA) assemblies,' Proc. Surface Mount Int. Conf., pp. 315-326
- Skipor, A.F., Harren, S.V. and Botsis, J., 1996, 'On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder,' ASME. J. Eng. Mater. Technol., Vol. 118, pp.1-11 https://doi.org/10.1115/1.2805929
- Corbin, J.S, 1993, 'Finite Element Analysis for Solder Ball Connect (SBC) Structural design Optimization, 'IBM J. Research Development, Vol. 37, pp, 585 - 596 https://doi.org/10.1147/rd.375.0585
- Lee, T., Lee, J. and Jung, I., 1998, '10.1016/S0026-2714(98)00163-2,' Microelectronics and Reliability, Vol. 38, No. 12, pp. 1941-1947
- Post, D., Han, B. and Ifju, P., High Sensitivity Moire Experiental Analysis for Mechanics and Materials, Springer-Verlag, New York
- Joo. J. W., Chai S. E. and Shin, D. I., 2001, 'Deformation Analysis of Composite-Patched Concrete Using Moire Interferometry,' Transactions of the KSME, A, Vol. 26, No. 1, pp. 160 - 170
- Post, D., Wood, J. D., Han, B. Parks, V. J. and Gerstle, Jr, F. P., 1992, 'Thermal Stresses in a Bimaterial Joint : An Experimental Analysis,' J. Applied Mechanics, Trans. ASME, Vol. 61, pp. 192-198
- Y. Guo, D. Post and B. Han, 1992, 'Thick Composites in Compression: An Experimental Study of Micro-mechanical Behavior and Smeared Engineering Properties,' J. Composite Material, Vol. 26, No.13, pp.1930-1944 https://doi.org/10.1177/002199839202601304
- Guo, Y., Lim, C. K., Chen, W.T. and Woychik, C. G., 1993, 'Solder Ball Connect (SBC) Assemblies Under Thermal Loading: I. Deformation Measurement via Moire Interferometry, and Its Interpretation, 'IBM J. Research Development, Vol. 37, pp. 635-648 https://doi.org/10.1147/rd.375.0635
- Han, B. and Guo, Y., 1995, Thermal Deformation Analysis of Various Electronic Packaging Products by Moire and Microscopic Moire Interferometry,' J. Electronic Packaging, Trans. ASME, Vol. 117, pp. 185-191 https://doi.org/10.1115/1.2792090
- Han, B., 1998, 'Recent Advancements of Moire and Microscopic Moire Interferometry for Thermal Deformation Analysis of Microelectrics Devices,' Experimental Mechanics, Vol. 38, No.4, pp. 278-288
- Stout, E.A., Sottos, N.R and Skipor, A.F. 2000, 'Mechanical Characterization of Plastic Ball Grid Array Package Flexure Using Moire Interferometry,' IEEE Trans. on Advanced Packaging. Vol. 23, No.4, pp. 637-645 https://doi.org/10.1109/6040.883753