Hydro Dynamic Model을 이용한 CMOS의 파괴특성의 Transient Simulation해석

Transient Simulation of CMOS Breakdown characteristics based on Hydro Dynamic Model

  • 최원철 (하이닉스반도체 System IC 소자기술팀)
  • 투고 : 2001.11.05
  • 심사 : 2002.02.20
  • 발행 : 2002.02.28

초록

In present much CMOS devices used in VLSI circuit and Logic circuit. With increasing a number of device in VLSI, the confidence becomes more serious. This paper describe the mechanism of breakdown on CMOS, especially n-MOS, based on Hydro Dynamic model with device self-heating. Additionally, illustrate the CMOS latch-up characteristics on simplified device structure on this paper.

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