Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Trends and Prospects of Domestic Joining Technology in Electric.Electronic Field

전기전자분야에서의 국내 접합기술 현황 및 전망

  • Published : 2002.10.01
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Abstract

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References

  1. 한일 반도체 패키징 기술 세미나 Current Semiconductor Packaging in Japan Kunihiko Nishi
  2. 대한금속학회 v.12 전자산업에서의 마이크로 솔더링 기술 신영의;정재필;강춘식
  3. Ball Grid Array John H. Lau
  4. Electronic Packaging John H. Lau
  5. Modern Solder Technology for Competitive Electronics Manufacturing Jennie S. Hwang
  6. Manufacturing Challenges in Electronic Packaging Y.C. Lee;W.T. Chen
  7. Surface Mount Technology with Fine Pitch Components Hans Danielsson
  8. 무연 마이크로솔더링 신영의(외)
  9. 용접 · 접합 편람 대한용접학회