Journal of the Institute of Electronics Engineers of Korea TC (대한전자공학회논문지TC)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Analysis and Suppression of Parasitic Resonance in Millimeter-wave Ceramic Packages

밀리미터파용 세라믹 패키지에서의 기생공진 해석 및 억제 방법

  • Seo, Jae-Ok (Dept.of Electronics Engineering, Ajou University) ;
  • Kim, Jin-Ryang (Dept.of Electronics Engineering, Ajou University) ;
  • Lee, Hae-Yeong (Dept.of Electronics Engineering, Ajou University)
  • Published : 2002.02.01
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Abstract

High performance packages must protect circuits from the internal leakaged-electromagnetic fields as well as the surrounding. In this paper, we characterized an electromagnetically-shielded millimeter-wave ceramic package from 20 to 40 ㎓ using FEM(Finite Element Method). From these calculation results, the parasitic resonance is observed at 33.4 ㎓. We use metal-filled via-holes at the ceramic package walls and resonance has been suppressed in a frequency range from 20 to 40 ㎓. These calculation results will be helpful for MMIC packaging using electromagnetically-shielded millimeter-wave ceramic packages.

패키지는 외부 회로에 의한 내부 회로의 보호와 함께 내부회로로부터의 누설 전자파가 전체 회로 성능에 영향을 미치지 않도록 하여야 한다. 본 논문에서는 유한요소법(FEM : Finite Element Method)을 이용하여 20~40 ㎓까지 전자기적으로 차폐된 밀리미터파 대역용 세라믹 패키지의 광대역 특성을 해석하였다. 해석 결과, 패키지 외부를 전자기적으로 차폐시킴으로써 33.4 ㎓에서 기생공진 현상이 발생함을 확인하였다. 패키지의 이러한 기생공진 현상을 억제하기 위해 세라믹 패키지 벽에 금(Gold)이 채워진 금속봉을 이용하였으며, 그 결과 세라믹 패키지의 상용 대역인 20~40 ㎓에서 공진 현상을 효과적으로 제거할 수 있었다. 따라서 본 해석결과는 전자기적으로 차폐된 밀리미터파 대역용 세라믹 패키지를 이용한 MMIC (Monolithic Microwave Integrated Circuit) 실장에 유용하게 사용될 수 있을 것으로 기대된다.

Keywords

References

  1. I. D. Robertson, MMIC Design, IEEE, London, UK, 1995
  2. L. P. B. Katehi, 'The role of EM modeling in integrated packaging,' IEEE AP-S DIg., pp. 1005-1008, July. 1993 https://doi.org/10.1109/APS.1993.385184
  3. Hao-Hui Chen and Shyh-Jong Chung, 'Analysis of a Partially Sealed Package for Microstrip-Line Circuits,' IEEE Trans. on Microwave Theory and Techniques, Vol. 46, No. 12, pp.2124-2130, DEC. 1998 https://doi.org/10.1109/22.739293
  4. Robert W. Jackson and Zhaoyang Wang, 'Circuit Based Model for Coupling Between MMICs in Multi-Chip Assemblies,' IEEE MTT-S Digest, No. III, pp. 1377-1380, 1997 https://doi.org/10.1109/MWSYM.1997.596585
  5. Jong-Gwan Yook, Linda P. B. Katehi, Rainee N Simons, and Kurt A. Shalkhauser,'Experimental and Theoretical Study of Parasitic Leakage/Resonance in a K/KA-Band MMIC Package,' IEEE Trans. on Microwave Theory and Techniques, Vol. 44, No. 12, pp. 2403-2410, DEC. 1996 https://doi.org/10.1109/22.554569
  6. Tsugumichi Shibata, Shunji Kimura, Hideaki Kimura, Yuhki Imai, Yohtaro Umeda, Yukio Akazawa, '60Ghz-Bandwidth Distributed Baseband Amplifier IC in a Package Optimized for Isolation,' IEEE International Solid-State Circuit Conference, 1994 https://doi.org/10.1109/ISSCC.1994.344690
  7. Jmaes Schellenberg, 'High-Efficiency, Packaged Ka-Band MMIC Operating at 24 Volts,' IEEE MTT-S Digest, Vol. 2, pp. 577-580, 1998 https://doi.org/10.1109/MWSYM.1998.705059
  8. T. Satoh, T. Shimura, S. Ichikawa, A. Betti-Berutto, C. Poledrelli, Y. Furukawa, Y. Hasegawa, S. Kuroda and J. Fukaya, 'A Compact PA MMIC Module for K-Band High-Speed Wireless Systems,' IEEE MIT-S Digest, Vol. III, pp. 1333-1336, 2000 https://doi.org/10.1109/MWSYM.2000.861766
  9. George E. Ponchak, Donghoon Chun Jong-Gwan Yook, and Linda P. B. Katehi, 'Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages,' IEEE Trans. on Advanced Packaging, Vol. 24, No. 1, pp. 76-80, FEB. 2001 https://doi.org/10.1109/6040.909628
  10. 조남태, 심광보, 이선우, 구기덕, '고주파용 저온 동시소성 세라믹(LTCC) 칩 커플러 제조 : I. 전극형성에 대한 결합제 분해공정의 영향,' Journal of the Korean Ceramic Society, Vol. 36, No. 6, pp. 583-589, 1999
  11. Rao R Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, Microelectronics Packaging Handbook, CHAPMAN & HILL Corporation
  12. S. Nelson, M. Youngblood, J. Pavio, B. Larson, R. Kottman, 'Optimum microstrip interconnects,' Proc. IEEE MITT-s Dig., Boston, MA, pp. 1071-1074, 1991 https://doi.org/10.1109/MWSYM.1991.147199
  13. A Fathy, V. Pendrick, G.Ayers, B. Geller, Y. Narayan, B. Thaler, H. D. Chen, M. J. Libertore, J. Prokop, K. L. Choi, M. Swaminathan, 'Design of Embedded Passive Components in Low-temperature Cofired Ceramic on Metal(LTCC-M) Technology,' IEEE MTT-S Digest, Vol. III, pp. 1281-1284, 1998 https://doi.org/10.1109/MWSYM.1998.700608
  14. Dipak Ceramic Package, Dielectric Laboratories, INC.
  15. HFSS (High Frequency Structure Simulator), ver 7.0, Ansoft