The Magazine of the IEIE (전자공학회지)

The Institute of Electronics and Information Engineers (대한전자공학회)
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MMIC Packaging

  • 김용훈 (광주과학기술원 기전공학학과 센서시스템연구실)
  • Published : 2002.02.01
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Abstract

Keywords

References

  1. Topical Symposium on Millimeter Waves(TSMMW) Interconnects and Packaging of Millimeter-Wave Circuits W. Menzel
  2. Microwave Journal v.44 no.9 A DC to 50Ghz and Beyond MMIC Carrier Hei Broadband
  3. 밀리미터파 대역 증폭기 최적 설계를 위한 기생성분의 모델을 이용한 설계 및 구현에 관한 연구 박필재
  4. Microwave Workshop Digest Yokohama Interconnects and Packaging for Microwave Devices Fuminori Ishitsuka
  5. IEEE MTT-S Int. Micorowave Symp. Dig. A flip chip bonding technology using gold pillars for millimeter-wave application Aoki, S.;Someta, H.Yokokawa, S.;Ono, K.;Hirose, T.;Ohashi, Y.
  6. Production catalog