References
- Topical Symposium on Millimeter Waves(TSMMW) Interconnects and Packaging of Millimeter-Wave Circuits W. Menzel
- Microwave Journal v.44 no.9 A DC to 50Ghz and Beyond MMIC Carrier Hei Broadband
- 밀리미터파 대역 증폭기 최적 설계를 위한 기생성분의 모델을 이용한 설계 및 구현에 관한 연구 박필재
- Microwave Workshop Digest Yokohama Interconnects and Packaging for Microwave Devices Fuminori Ishitsuka
- IEEE MTT-S Int. Micorowave Symp. Dig. A flip chip bonding technology using gold pillars for millimeter-wave application Aoki, S.;Someta, H.Yokokawa, S.;Ono, K.;Hirose, T.;Ohashi, Y.
- Production catalog