Evaluation of Metallurgical Characteristics and Strength on Soldered Joint

솔더링부의 금속학적 특성 및 강도 평가

  • 이재식 (서울시립대학교 신소재공학과) ;
  • 정재필 (서울시립대학교 신소재공학과) ;
  • 김숙환 (포항산업과학연구원 용접센터)
  • Published : 2002.08.01

Abstract

Keywords

References

  1. Handbook of Fine Pitch Surface Mount Technology J.H. Lau
  2. Solderjoint reliability of BGA, CSP, Flip Chip, and Fine pitch SMT Assemblies J.H. Lau;Yi-Hsin Pao
  3. Reliable Solder Joint Using Sn-Pn-La Solder Alloy, Physical and Failure Analysis of Integrated Circuits X. Ma;Y.Y. Qian;F. Liu;F. Yoshida
  4. Microelectronics Packaging Handbook Jeanotte, D.A.;Goldman, L.S.;Howard, R.T.
  5. Reliability and Testing, Principles of Electronic Packaging Marsh, L.L.;Evans, R.D.;Wang, S.C.;Malack, J.A.;Ulsh, H.B.
  6. Handbook of Tape Automated Bonding Evans, H.;O'Hara, J.P.;Viswanadhm, P.
  7. 鉛 フリ - はんだに관한 조사연구성과보고서 일본전자공업진흥협회
  8. 鉛 フリ - はんだ付け 技術 Suganuma
  9. 임승수 무연 마이크로 솔더링 정재필;신영의
  10. 서울시립대 석사논문 김문일
  11. Mater. Trans. M.K. Kim;J.K. Moon;J.P. Jung
  12. J. Electronic Materials v.30 J.Y. Park;C.W. Yang;J.S. Ha;C.U. Kim;E.J. Kwon;S.B. Jung;C.S. Kang https://doi.org/10.1007/s11664-001-0145-5
  13. Chem. Mater. C.E. Ho;Y.L. Lin;C.R. Kao
  14. Proceedings of japan International Electronic Manufacturing Technology Symposium Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Condition Lau, J.
  15. Circuit world Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Condition Lau, J.;K. Gratalo;E. Schneider;T. Marcotte;T. Baker