Journal of Welding and Joining

  • 제20권3호
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  • Pages.116-121
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  • 2002
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

질화규소와 실리케이트계 유리의 젖음성에 관한 연구

A Study fur Wettability of Silicate Glasses on Silicon Nitride

  • 안병국 (전북대학교 공과대학 신소재공학부/신소재개발연구센터)
  • 발행 : 2002.06.01
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초록

For the accumulation of a fundamental knowledge about the behavior of glass solder during the joining of ceramics, the wettability of solder on silicon nitride have been measured by sessile drop method. $SiO_2-MgO-Al_2O_3$ g1ass solder and oxynitride glass solders were selected as examples while silicon nitride which were used as substrates. Contact angle of solder on silicon nitride didn't decrease with time at high nitrogen content in the solder, but low nitrogen content in solders have the time-dependent property. Reason which contact angle of low nitrogen content in solders decrease on silicon nitride was that diffusion of nitrogen take place between solder and silicon nitride.

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