A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation

  • Huh, Y.J. (School of Mechatronics Engineering, Korea University of Technology and Education)
  • 발행 : 2002.03.01

초록

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

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