Development of Laser Process and System for Stencil Manufacturing

레이저 스텐실 가공 시스템 및 공정 기술 개발

  • Lee, Jae-Hoon (Laser Technology Research Group, Korea Institute of Machinery and Materials) ;
  • Suh, Jeong (Laser Technology Research Group, Korea Institute of Machinery and Materials) ;
  • Kim, Jeng-O (Laser Technology Research Group, Korea Institute of Machinery and Materials) ;
  • Shin, Dong-Sig (Dept. of Mechanical Engineering, Graduate School of Kyungpook National University) ;
  • Lee, Young-Moon (Dept. of Mechanical Engineering, Kyungpook National University)
  • 이제훈 (한국기계연구원 레이저기술연구그룹) ;
  • 서정 (한국기계연구원 레이저기술연구그룹) ;
  • 김정오 (한국기계연구원 레이저기술연구그룹) ;
  • 신동식 (경북대학교 대학원 기계공학과) ;
  • 이영문 (경북대학교 기계공학부)
  • Published : 2002.02.01

Abstract

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

Keywords

References

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