Journal of Sensor Science and Technology (센서학회지)

The Korean Sensors Society (한국센서학회)
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Fabrication of SOI Structures with Buried Cavities for Microsystems SDB and Electrochemical Etch-stop

SDB와 전기화학적 식각정지에 의한 마이크로 시스템용 매몰 공동을 갖는 SOI 구조의 제조

  • 정귀상 (동서대학교 정보시스템공학부) ;
  • 강경두 (동서대학교 정보시스템공학부) ;
  • 최성규 (영남대학교 전자공학과)
  • Published : 2002.01.31
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Abstract

This paper describes a new process technique for batch process of SOI(Si-on-Insulator) structures with buried cavities for MEMS(Micro Electro Mechanical System) applications by SDB(Si-wafer Direct Bonding) technology and electrochemical etch-stop. A low-cost electrochemical etch-stop method is used to control accurately the thickness of SOI. The cavities were made on the upper handling wafer by Si anisotropic etching. Two wafers are bonded with an intermediate insulating oxide layer. After high-temperature annealing($1000^{\circ}C$, 60 min), the SDB SOI structure with buried cavities was thinned by electrochemical etch-stop. The surface of the fabricated SDB SOI structure have more roughness that of lapping and polishing by mechanical method. This SDB SOI structure with buried cavities will provide a powerful and versatile substrate for novel microsensors arid microactuators.

본 논문은 Si기판 직접접합기술과 전기화학적 식각정지를 이용하여 마이크로 시스템용 매몰 공동을 갖는 SOI 구조물의 일괄제조에 대한 새로운 공정기술에 관한 것이다. 저비용의 전기화학적 식각정지법으로 SOI의 정확한 두께를 제어하였다. 핸들링 기판 위에서 Si 이방성 습식식각으로 공동을 제조하였다. 산화막을 갖는 두 장의 Si기판을 직접접합한 후, 고온 열처리($1000^{\circ}C$, 60분)를 시행하고 전기화학적 식각정지로 매몰 공동을 갖는 SDB SOI 구조를 박막화하였다. 제조된 SDB SOI 구조물 표면의 거칠기는 래핑과 폴리싱에 의한 기계적인 방법보다도 우수했다. 매몰 공동을 갖는 SDB SOI 구조는 새로운 마이크로 센서와 마이크로 엑츄에이터에 대단히 효과적이며 다양한 응용이 가능한 기판으로 사용될 것이다.

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