Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Properties and low loss packing of $LiNbO_3$ Optical Modulator for a Broadband Optical Communications

광대역 광통신을 위한 $LiNbO_3$ 광변조기소자의 저손실 패키징 및 특성에 관한 연구

  • Yun, Hyeong-Do (Optical Research Center, Korean Electronics Technology Institute) ;
  • Lee, Han-Yeong (Optical Research Center, Korean Electronics Technology Institute) ;
  • Yun, Dae-Won (Optical Research Center, Korean Electronics Technology Institute) ;
  • Lee, Gyeong-Sik (Dept.of Electronics Engineering, Sungkyunkwan University)
  • 윤형도 (전자부품연구원 광부품연구 센터) ;
  • 이한영 (전자부품연구원 광부품연구 센터) ;
  • 윤대원 (전자부품연구원 광부품연구 센터) ;
  • 이경식 (성균관대학교 전자공학과)
  • Published : 2001.05.01
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Abstract

The issues that influence the packaging of high-speed LiNbO$_{3}$ modulators are discussed, and packaging approaches that result in only minor degradation of the modulator's RF performance are described. The primary problems dealt in this paper, associated with high-speed device packaging, are fallen into the following five categories: die features, pigtailing, suppression of RF package resonance, RF launcher approach, termination approach. By considering factors to influence the modulator performance in packaging, a LiNbO$_{3}$ intensity modulator was fabricated and packaged to have S21 better than -3㏈ upto 10㎓ and S11 below -l5㏈ upto 18㎓.

광대역 초고속 광변조기소자 패키지와 연계되는 주요 문제점인 die feature, pigtailing, suppression of RF package resonance, RF launcher approach, termination approach의 5가지 특성을 차례로 분석한 후 우수한 특성이 나올 수 있도록 소자를 패키징하였다. Microcoax에 의해 패키징된 변조기의 전기적 특성인 S21은 10㎓ 이상까지 -3㏈ 이상의 파워를 유지하였고, S11은 18㎓까지 -l5㏈를 유지하였다. 10㎓까지 광파워는 최대값으로부터 3㏈ 이상 떨어지지 않았고 50km 전송실험 후 소광비는 약 10.6㏈, 지터 값은 3.2ps로 양호한 값을 나타내어 패키징을 원만히 해결해야만 변조기의 변조 능력은 10㎓ 이상이 됨을 알 수 있다.

Keywords

References

  1. R. A. Becker, B. E. Kincaid, 'Rugged, Low-Cost Pigtailing Approach for $LiNbO_3$ Integrated Optic Devices', IEEE Journal of Lightwave Technology, VOL.12, NO.1, pp. 44-48, 1994 https://doi.org/10.1109/50.265733
  2. 윤형도, 이한영, 윤대원, '$Ti:LiNbO_3$ 광변조기 소자의 패키징 및 전기.광학적특성', 전자공학회지 제35권 D 편 제6호, pp. 72-78,1998
  3. Michael R. Matthews, Brain M. Macdonard, Keith R. Preston, 'Optical Components-Challenge in Packaging', IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, no.4, pp. 798-806, 1990 https://doi.org/10.1109/33.62521
  4. Leslie A. Reith, James W. Mann, Chung-en Zah,'Single-Mode Fiber Packaging for Semiconductor Optical Devices', IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol.13, no.4, pp. 791-797, 1990 https://doi.org/10.1109/33.62520
  5. Bernd Valk, Rainer Batting, Olivier Anthamatten, 'Laser Welding for Fber Pgtailing with Long-term Stability and Submicron Accuracy', Optical Engineering, vol. 34, no. 9, pp. 2675-2682, 1995 https://doi.org/10.1117/12.200621
  6. Michael J. Wale, Colin Edge, 'Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections', IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, no. 4, pp. 780-786, 1990 https://doi.org/10.1109/33.62593
  7. Richard A. Soref, 'Silicon-Based Optoelectronics', Proceeding of The IEEE, vol.81, no.12, Dec.1993 https://doi.org/10.1109/5.248958
  8. Paola Cinato, Kenneth C. Young, 'Opical Interconnections within Multichip', Optical Engineering, vol.32, no.4, pp. 852-860, 1993 https://doi.org/10.1117/12.132400