대한기계학회논문집B (Transactions of the Korean Society of Mechanical Engineers B)

  • 제24권5호
  • /
  • Pages.632-639
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  • 2000
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  • 1226-4881(pISSN)
  • /
  • 2288-5324(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
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3차원 채널 밑면에 탑재된 모듈로부터의 혼합대류열전달

Mixed Convection Transport from a Module on the Bottom Surface of Three Dimensional Channel

  • 이진호 (육군제3사관학교 기계공학과) ;
  • 박상희 (금오공과대학교 기계공학부) ;
  • 유갑종 (경북대학교 기계공학부) ;
  • 방창훈 (경북전문대학 소방안전과)
  • 발행 : 2000.05.01
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초록

Conjugate heat transfer from a heat generating module ($31{\times}31{\times}7mm^3$) bonded through the module support on the floor of a parallel-plate channel(20mm high, 400mm wide, and 800mm long) to mixed convective air flow(0.2${\sim}$0.9m/s) is studied experimentally. The input power to the module is changed in a range 1.0${\sim}$4.5W, the floor thickness 0.2${\sim}$5mm, and the thermal resistance of module support, Rc:=0.06, 1.03 and 82.0K/W. Thermal conductance(Uc) of the board and convective thermal conductance($U_A$) from the module were derived, and the effect of V; Rc and t on Uc was investigated. It is found that the conjugate conductance (Uc) and the conductive heat transfer ratio ($Q_B$/Q) depend on the thermal resistance of the module support, the air velocity and the board thickness. The change of the module support resistance and the board thickness helps to elucidate the relative significance of heat transfer paths through the module support, the board, and from the board surface to the air. Additional information is investigated about the dependence of the heat transfer rate on the mixed convection parameter.

키워드

참고문헌

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