한국산업융합학회 논문집 (Journal of the Korean Society of Industry Convergence)
- 제3권1호
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- Pages.69-75
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- 2000
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- 1226-833X(pISSN)
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- 2765-5415(eISSN)
플립 칩의 기하학적 형상과 구성재료의 변화에 따른 효과
Effect by Change of Geometries and Material Properties for Flip-Chip
- Kwon, Yong-Su (Dept. of Vehides Mechanics, Kyongdo Provincial College) ;
- Choi, Sung-Ryul (School of Mechanical Engineering, Yeungnam Univ.)
- 투고 : 1999.12.27
- 심사 : 2000.02.25
- 발행 : 2000.02.28
초록
Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.