대한전기학회논문지:전기물성ㆍ응용부문C (The Transactions of the Korean Institute of Electrical Engineers C)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

정전 열 접합을 이용한 FED 스페이서의 초청정 정렬/탑재 공정 개발

Development of Ultra-Clean Aligning/Mounting Process of FED Spacers using Electrostatic Bonding

  • 주병권 (KIST 정보재료소자연구센터) ;
  • 강문식 (KIST 정보재료소자연구센터) ;
  • 이윤희 (KIST 정보재료소자연구센터)
  • 발행 : 2000.11.01
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초록

In this paper, a new idea about ultra-clean aligning and mounting method of FED spacers was introduced. The glass-to -glass electrostatic bonding process was employed in order to bond the micro-structures of spacers to black matrix area formed on an FED anode substrate. It is possible to get adhesive-free bonding interface and well-aligned spacer array on an FED anode substrate with a ${\pm}5{\mu}m$ accuracy. Finally, I inch-sized FED panel was demonstrated to make sure of its applicability to FED panel fabrication.

키워드

참고문헌

  1. D.A.Cathey, Jr, Field-emission displays, Information Display, pp. 16-20 (1995. 10.)
  2. 주병권, 오명환, 기판 접합 공정 및 이를 이용한 MEMS/FED packaging 기술동향, 전기학회지, 제47권, 12호, pp. 21-29 (1998. 12)
  3. W.B.Choi, B.K.Ju, Y.H.Lee, S.J.Jeong, N.Y.Lee, M.Y.Sung and M.H.Oh, 'Glass-to-Glass bonding for vacuum packaging of field emission display in an ultra-high vacuum chamber using silicon thin film,' J. Electrochem. Soc., vol.146, no.1 pp.400-404 (1999.1) https://doi.org/10.1149/1.1391621