Transactions on Electrical and Electronic Materials
- Volume 1 Issue 3
- /
- Pages.23-28
- /
- 2000
- /
- 1229-7607(pISSN)
- /
- 2092-7592(eISSN)
Improvement of Adhesion Strength between Cu-based Leadframe and Fpoxy Molding Compound
- Lee, Ho-Yoing (The George W. Woodruff School of Mechanical Enginnering, Georgia Institute of Technology, Atlanta)
- Published : 2000.09.01
Abstract
A block-oxide layer was formed on the surface of Cu-based leadframe by chamical oxidation method in order to enhance the adhesion strength between Cu-based leadframe and epoxy molding compound (EMC) Using sandwiched double cantilever beam (SDCB) specimens, the adesion strength was measured in terms of interfacial fracture toughness, G
Keywords
- black-oxide layer;
- Cu-baed leadframe;
- epoxy molding compound;
- adhesion strength;
- interfacial fracture toughness