참고문헌
- Demand for developement of indistrial technology towards year 2000 v.23 Korea Institute of Industrial Technology Evaluation and Planning
- Flip Chip Technologies H. Lau(ed.)
- The Mechanics of Solder Alloy Wetting and Spreading F. G. Yost;F. M. Hosking;F. M. Frear
- SMT Soldering Handbook 2nd ed. Rudolf Strauss
- Soldering in Electronics R. J. Wassink
- JEM v.23 no.6 The Effect of Gold-Nickel Metallization Microstructure on Fluxless Soldering R.B. Cinique;J.W. Morris
- Jpn. J. Appl. Phys. v.33 Solderability of Electroless Nickel Alloys Using Wetting Balance Technique C.Y. Lee;K.L. Lin
- EEP v.4 no.2 An Analysis of the Applicability of Wetting Balance Measurements of Components with Dissimilar Surfaces L.M. Racz;J. Szekely
- TMS Physical metallurgy of the solder-substrate reaction A.D.Roming(et al.);Solder Mechanics(ed.);D.R.Frear(et al.)
- Soldering & Surface Mount Technology no.4 Quantitative Solderability Measurement of Electronic Components Part 2 : An Index of Solderability C. Lea;W.A. Dench
- Proc. of Electronic Components and Technology Conference Masahiko(et al.)
- Verbindungstechnik in der Elektnonik W. Moeller;D. Knoedler
- IEEE Transactions on Advanced Packaging v.22 no.4 Wei Lin;Y. C. Lee
- Solder Mechanics D. R. Frear;W. B. Jones;K. R. Kinsman(ed.)
- The Metal Science of Joining, TMS An Overview of the Measurements P.T. Vianco
- Journal of the Microelectronics & Packaging Society v.7 no.2(16) A Study on the Wetting Properties of UBM-coated Si-wafer S. M. Hong(et al.)
- J. Kor. Inst. Analysis of Wetting Force on One Side Coated Cu/Cr-Si Substrate Using Wetting Balance Method J. Y. Park;S. M. Hong;C. H. Kang;J. P. Jung
- J. Mater. Res. v.10 H. K. Kim;H. K. Liou;K. N. Tu
- H. H. Solders and Soldering Manko
- Journal of the Microelectronics & Packaging Society v.7 no.2(16) The Fluxless Wetting Properties of TSM-coated Glass Substrate to the Pb-Free Solders S. M. Hong(et al.)